Samsung Electro-Mechanics Co., Ltd.

Se Hwa Jeong

Young Ghyu Ahn

Sang Soo Park

Min Cheol Park

Hwi Dae Kim

A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween in a first direction; and external electrodes connected to the internal electrodes. The body has first and second surfaces opposing each other in the first direction and one or more side surfaces positioned between the first and second surfaces. The body has a protruding portion protruding in the first direction and outer peripheral portions around the protruding portion on the first surface of the body. The external electrodes cover the outer peripheral portions, the side surfaces, and the second surface of the body. In the second surface of the body, portions that are covered by the external electrodes and a portion that is not covered by the external electrodes are substantially coplanar with each other.

Multilayer electronic component

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Growing community of inventors

Gyunggi-do, South Korea

Se Hwa Jeong