Samsung Display Co., Ltd.

Se-Hul Jang

Joo-Yeon Won

Chong-Guk Lee

Su-Mi Moon

Dong-Wook Lee

A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Growing community of inventors

Yongin-si, South Korea

Se-Hul Jang