Samsung Techwin Co., Ltd.

Se-hoon Cho

Jong-soon Kim

Byung-yong Yum

Dong-kwan Won

Jeung-Il Kim

Jeung-il Kim

Sang-moo Lee

A method of transferring graphene, the method including: preparing a graphene forming structure including a base member, an oxide layer that is hydrophilic and is formed on the base member, a metal catalyst layer that is hydrophobic and is formed on the oxide layer, and graphene that is formed on the metal catalyst layer; attaching the graphene forming structure on a surface of a first carrier; separating the oxide layer from the metal catalyst layer by applying steam to the graphene forming structure; and removing the metal catalyst layer.

Method of transferring graphene

A magnetic levitation sliding structure including a first slide member, and a first magnetic portion which is disposed in the first slide member to extend along the lengthwise direction of the first slide member and has magnetic poles arranged perpendicular to the lengthwise direction of the first slide member with the lengthwise direction of the first slide member being an extending direction. The structure further includes a second slide member slidingly engaged with the first slide member, and a second magnetic portion which is disposed in the second slide member to extend parallel to the first magnetic portion and has magnetic poles with opposite magnetic polarity to those of the first magnetic portion in order for the first and second magnetic portions to repel each other.

Magnetic levitation sliding structure

An apparatus controlling a specific function is provided. The specific function controlling apparatus includes a signal generator and a recognizer. The signal generator transmits and receives a first signal of a specific frequency. The recognizer is installed in a specific function module having a specific function device for executing a specific function. The specific function module is installed in an electronic equipment. The recognizer includes an antenna part and a control part. The antenna part is responsive to the specific frequency of the signal generator. The control part is electrically connected to the specific function device and the antenna part to control the specific function according to the first signal.

Apparatus for controlling specific function and camera module having the same

Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

A magnetic levitation sliding structure is provided for a portable electronic device. The sliding structure includes a first slider member with a guide portion, a second slider member with a receiving portion that mates with the guide portion, a first magnet coupled with the guide portion and having magnetic poles arranged in a direction perpendicular to a sliding direction, and a spaced-apart pair of second magnets coupled with the receiving portion. The first magnet is configured in a central portion of the guide portion and is disposed between the spaced-apart pair of second magnets for facilitating relative sliding movement of the first and second slider members. A portable electronic device including the magnetic levitation sliding structure is also provided.

A low friction and stable sliding structure for an electronic device is provided. The sliding structure includes a first sliding member comprising at least one guide portion, a second sliding member including a receiving portion receiving the guide portion so as to slide along the first sliding member, a first magnet portion disposed in the guide portion, such that magnetic poles of the first magnet portion are arranged across a sliding direction, and a second magnet portion disposed in the receiving portion so that a repulsive force can act between the first magnet portion and the second magnet portion.

A low friction and stable sliding structure for an electronic device that reduces the thickness of the electronic device. The sliding structure includes a first sliding member including at least one first guide portion, a second sliding member including a first receiving portion slidably receiving the first guide portion, and at least one second guide portion formed on a plane different from that on which the first receiving portion is formed, a third sliding member including a second receiving portion slidably receiving the second guide portion. The sliding structure further includes an arrangement of first, second, third and fourth magnet portions configured to enable the first and second sliding member to slide smoothly with respect to each other.

Sliding structure for electronic device

A hydrodynamic fluid film bearing for supporting a rotation shaft of a turbo or rotary apparatus includes a sleeve having a circular inner opening for receiving a rotation shaft therein, at least one metallic foil member of arc shape having one end fixed to the inner surface of the sleeve and arranged along the inner opening of the sleeve, and at least one elastic member disposed at the sleeve between the sleeve and the foil member. A bearing housing for receiving a bearing of a rotary apparatus is further provided, in which the bearing housing includes a circular opening for receiving the bearing therein, and the circular inner opening of the bearing housing includes grooves for cooling air passage formed at regular interval in the axial direction on the inner surface of the bearing housing. The bearing received in the bearing housing is preferably a hydrodynamic fluid film bearing.

Hydrodynamic fluid film bearing and bearing housing with cooling capacity

A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.

Method of manufacturing substrate for circuit board and smart label having the substrate

Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.

Lead frame for semiconductor package and method of fabricating semiconductor package

A wireless communication device is disclosed. The wireless communication device comprises a body; and an input/output port installed on a side of said body and electrically connected to an antenna connecting portion of a communication module installed in said body. Thus, the input/output port of the wireless communication device also functions as the antenna.

Integrated antenna and input/output port for a wireless communication device

A smart label includes an antenna formed with a narrow film or panel-like material rolled in a roll, the film having one face of conductive layer and an opposite face of nonconductive layer, and a semiconductor chip attached to a side surface of the rolled antenna, the semiconductor chip having a first connection terminal connected to the conductive layer at a location adjacent to an outermost winding of the antenna and a second connection terminal connected to the conductive layer at a location adjacent to an innermost winding of the antenna.

Growing community of inventors

Seongnam-si, South Korea

Se-hoon Cho