Samsung Electronics Co., Ltd.

Se Ho Park

Keum Su Song

Yu Su Kim

Dong Zo Kim

Han Seok Park

Ki-Hyun Kim

Young-Min Lee

Ji Young Kim

Chang Ho Lee

Ji Hye Kim

Seok-myong Kang

Woo Jin Jung

Jung Su Park

Young Joon Park

Kyung Min Park

Ji Won Kim

Ki Hyun Kim

Ju Hyang Lee

Chi Hyun Cho

Yong Sang Yun

Mun-Hyun Do

Jin-Seong Yang

Ki Tae Lee

Min Ho Kang

Young Mi Ha

Kyoung Won Kim

Kwang Seob Kim

Min Cheol Ha

Hyung Koo Chung

Kang Ho Byun

Jin-Haing Kim

Kum Jong Sun

Woo Ram Lee

An apparatus for changing a wireless charging mode includes a power receiving antenna configured to receive power from a power supply using a first frequency band, a communication circuit configured to communicate with the power supply using a second frequency band, a power management circuit configured to charge a battery using the received power, and a control circuit configured to be electrically connected with the power management circuit. In addition, various embodiments ascertained through the specification are possible.

Apparatus and method for altering wireless charging mode

A power transmitting unit is provided. The power transmitting unit includes a signal generator configured to generate a signal of a first frequency band for wireless charging, a power generation circuit configured to generate a modulation signal for modulating the signal of the first frequency band generated by the signal generator, and amplify a transmit power of the signal of the first frequency band based on voltage supplied from the outside of the power transmitting unit, a power transmission circuit configured to transmit the amplified transmit power to a power receiving unit via a first antenna, a second antenna configured to receive information about a charging state from the power receiving unit through a second frequency band, and a control circuit configured to control a duty and frequency of the modulation signal based on the charging state.

Power transmission apparatus and power transmission method

An electronic device is provided. The electronic device includes a housing and a first coil disposed in the housing and wound around a space formed inside. The housing includes a front cover and a rear cover. The rear cover includes a hole located in a first region of the rear cover that corresponds to the space of the first coil, a first slit that extends from an edge of the rear cover to the hole, and a second slit spaced apart from the first slit and extending from the edge. One end of the second slit is located in a second region of the rear cover that corresponds to the first coil. In addition, various other embodiments recognized through the present specification are possible.

Electronic device including slotted conductive housing for eddy current control during wireless charging

An electronic device is provided. The electronic device includes a power receiver (PRx) that includes a receiver coil for receiving a power signal from a wireless power transmitting device and a wireless charging integrated circuit (IC) for converting the power signal into electrical energy, a power management circuit that is electrically connected to the PRx and configured to charge a battery using the electrical energy, and a processor that is electrically connected with the PRx and the power management circuit. The processor activates a power hold mode (PHM) if a charging level of the battery is a fully charged level and controls auxiliary charging of the battery.

Method and system for managing wireless charging

A leakage power processing method of an electronic device including a first conductive pattern that sends and receives a communication signal associated with a communication function, a second conductive pattern that is arranged adjacent to the first conductive pattern and sends and receives a power signal used for charging, and a communication hardware interface electrically connected with the first conductive pattern is provided. The leakage power processing method includes determining, by a processor of an electronic device, whether a specific power signal is induced through the second conductive pattern and forming, by the processor of the electronic device, a closed loop including the first conductive pattern if the specific power signal of a specific magnitude or greater is induced.

Processing method for leakage power and electronic device supporting the same

A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.

Method for fabricating printed circuit board

A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

Printed circuit board reinforcement structure and integrated circuit package using the same

An optical fiber having reduced residual stress discontinuity is disclosed. The optical fiber includes a core which is an optical transmission medium and a clad for surrounding the core. The residual stress discontinuity at an interface between the core and the clad is 20.0 MPa or less, which is represented by an absolute value of a difference between a minimum axial stress at (r/a)=0.8-1.1 and a maximum axial stress at (r/a)=1.0-1.2, wherein a is the radius of the core and r is a radius measured from the center of the core.

Optical fiber having reduced residual stress discontinuity

Disclosed is an amplifying optical fiber for amplifying optical signal transmitted therethrough by stimulated emission, the amplifying optical fiber comprising: an inner core disposed at a center of said optical fiber and containing MX, GaSand RE; an outer core surrounding said inner core and containing SiO; and a cladding surrounding said outer core and containing SiO, wherein said M contained in MX is one component selected from the group consisting of Na, K, Rb and Cs; said X contained in MX is one component selected from the group consisting of F, Cl, Br, and I; and said RE is one component selected from the group consisting of Ce, Pr, Pm, Nd, Sm, Eu, Gd, Tb, Ho, Dy, Er, Tm and Yb.

Amplifying optical fiber and method for fabricating the same

A plastic optical fiber and a method for producing the same is disclosed. The plastic optical fiber is formed as a fiber of core-cladding structure. A protective layer or shield layer may be provided on the outer surface of the optical fiber of core-cladding structure for improving thermal resistance of the optical fiber and protecting the optical fiber from air and moisture. The plastic optical fiber uses fluorinated plastic, which contains a rare earth component as a core material, and a cladding material, which does not comprise a rare earth component but essentially consists of a polymer chain, which essentially consists of bonded &#x2014;[CF]&#x2014; monomers and has a refractive index lower than that of the core material. The optical fiber is produced by a melting-drawing technique.

Plastic optical fiber and method for producing the same

Growing community of inventors

Yongin-si, South Korea

Se Ho Park