Avery Dennison Corporation

Scott Wayne Ferguson

Ian J Forster

Peikang Liu

David Nicholas Edwards

Jason D Munn

Christine U Dang

Steven C Kennedy

Yukihiko Sasaki

David Puleston

Dong-Tsai Hseih

Yi-Hung Chiao

Thomas Craig Weakley

Xiao-Ming He

Kuolih Tsai

Alan Morgenthau

Li Shu

Samuel A Linder

Ralf Linkmann

Werner Kiehne

James P Coleman

Ali Reza Mehrabi

Jaime Christopher Grunlan

Reza Mehrabi

Andrew W Holman

Kourosh Kian

Dave N Edwards

Frank B Woznic

Michael J Zajaczkowski

Michael Ross

N David Edwards

A method for labeling fabrics, such as fabric garments, and a heat-transfer label well-suited for use in the method. In one embodiment, the heat-transfer label includes (a) a support portion; and (b) a transfer portion, the transfer portion being positioned over the support portion for transfer of the transfer portion from the support portion to an article of fabric under conditions of heat and pressure, the transfer portion including (i) an ink design layer; (ii) a heat-activatable adhesive layer; and (iii) an RFID device.

Method for labeling fabrics and heat-transfer label well-suited for use in said method

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

High-speed RFID circuit placement method and device

A radio-frequency identification (RFID) tag includes a face stock and an RFID device. The face stock has a printable side and an inlay side, with the RFID device mounted to the inlay side. A layer of adhesive is coated on the inlay side of the face stock. A liner is releasably adhered to the layer of adhesive and includes a relief area that accommodates for defection of the RFID device. The accommodation of the thickness of the RFID device results in a tag that has a substantially uniform printable surface. Accordingly, when passing through a printer, the printable surface is maintained substantially flat or linear at the print head of the printer, thereby minimizing jamming and enhancing printability. A pinch roller for a printer also accommodates for deflection of the RFID tag by providing a deformable section along a length thereof the body that has a greater resiliency than the rest of the body. At the location of the RFID device, the layer of adhesive may also include a blank that is substantially free of adhesive for accommodating the RFID device.

RFID tag that provides a flat print area and a pinch that enables the same

A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

RFID device and method of forming

An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

A method for labeling fabrics, such as fabric garments, and a heat-transfer label () well-suited for use in said method. In one embodiment, the heat-transfer label () comprises (i) a support portion (), the support portion () comprising a carrier () and a release layer (); (ii) a wax layer (), the wax layer overcoating the release layer (); and (iii) a transfer portion (), the transfer portion () comprising an adhesive layer () printed directly onto the wax layer () and an ink design layer () printed directly onto the adhesive layer (). Each of the adhesive layer () and the ink design layer includes a non-cross-linked PVC resin. The ink design layer may be screen printed onto the adhesive layer () or may be printed onto the adhesive layer () using thermal transfer printing, ink jet printing or laser printing.

Heat transfer label for fabric with thermochromic ink and adhesive surface roughness

RFID tag that provides a flat print area and a pinch roller that enables the same

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Conductive pattern and method of making

A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

RFID device and method of making

A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.

A web of radio frequency identification (RFID) devices includes a conductive layer atop an insulating layer, the conductive layer having one or more apertures therein. Alternatively, the web may not include an insulating layer. RFID chips or straps are electrically coupled to portions of the conductive layer on either side of an aperture, for use as antennas when the RFID devices are separated from one another, as by cutting. The apertures may be formed by creasing portions of the web, and removing parts of the creased portion. There may be one or more apertures in a longitudinal or transverse direction of the web. The antenna shapes of various of the RFID devices may be tessellated, nesting within one another or having the same boundary, thereby improving efficiency by using substantially all of the conductive material. The RFID devices may be tested and/or programmed while remaining in the web format.

Low cost method of producing radio frequency identification tags with straps without antenna patterning

Method of making RFID device

A radio frequency identification (RFID) inlay includes a conductive connection electrically connecting an antenna to strap leads that are coupled to an RFID chip. The conductive connection may include conductive bumps attached to the strap, and/or may include conductive traces, such as a conductive ink traces. The conductive connections provide a convenient, fast, and effective way to operatively couple antennas and straps. The RFID inlay may be part of an RFID label or RFID tag.

A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.

Growing community of inventors

Pasadena, CA, United States of America

Scott Wayne Ferguson