Lucent Technologies Inc.

At&t Bell Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

Scott Thomas Davies

Francis McCarthy Mess

Chellappan Narayanan

Yuan P Li

George F DeVeau

Paul F Gagen

Nathan E Hardwick, Iii

James A Aberson

Daren Li

Joseph K Lo

Jianluo Zhang

Kevin G Sullivan

A method and apparatus for preparing end faces of integrated circuit chips using a cutting machine having a straight blade. The apparatus is a wedge shaped block having one surface angled at the desired angle to be imparted to the end face. The one surface has an alignment member thereon for aligning the chip on the top surface, and at least one locating member at the end of the block for positioning the end of the chip relative to the cutting blade. The block has a plurality of bores therein for applying suction to hold the chip on the one surface during cutting with the blade. The method includes the steps of placing a foot or feet on the chip, placing the chip on the block and aligning it and locating it, and applying a force thereto to hold it fixedly in position.

Method of preparing end faces on integrated circuits

A method for preparing operative end faces of integrated circuit chips or dies utilizes a beveled cutting blade to impart a desired contact angle to the operative end faces of the chip. The method includes the steps of mounting feet on the chip, trimming the feet where necessary, mounting the chip on a fixture with tape, cutting the end faces, and removing the chip from the fixture.

An optical interconnection device has a passive control mechanism for substantially eliminating thermal effects on optical properties of the apparatus Specifically, the interconnection apparatus includes a control material coupled to an optical circuit substrate, wherein the control material has a thermal expansion coefficient that is different than a substrate thermal expansion coefficient. In response to an increase or decrease an ambient temperature, the control material thermally expands or contracts at a different rate than the substrate to create a non-planar substrate distortion transmitted to the core portion, thereby creating a temperature independent optical path length within the optical core portion.

Optical device having a temperature independent spectral response using

An optical fiber splicing device (20) includes a glass cylindrically shaped capillary tube member (24) having a passageway formed therethrough eccentrically of the longitudinal axis of the capillary tube member. The capillary tube member is provided with a slot (86) such that a portion of the passageway in the form of a groove (88) extends across a planar surface (87) formed by the slot. The capillary tube member is mounted in a housing (22) which is made of a material and formed to provide a lens opposite to the slot to facilitate visual inspection of ends of end portions of two optical fibers which are positioned in the groove. A spring clamp (26) is mounted to the housing in a first position spaced from the planar surface to allow insertion of fiber end portions into the groove. The clamp is moveable to a second position where it is secured to the housing in a position which causes a portion of the clamp to engage the fiber end portions along at least a portion of the planar surface to hold the fiber end portions in secured alignment with each other.

Optical fiber splicing device

An optical fiber connector of the continuous groove type comprising a substrate with a multiplicity of fiber-receiving grooves thereon, and a cover member comprising compliant fiber-contacting material having a modulus of elasticity less than about 10.sup.6 psi (less than about 6.9 GPa), preferably less than 10.sup.5 psi. Connectors according to the invention can have low loss, and low added loss during thermal cycling. In a particular preferred embodiment, the substrate is a molded plastic part, and the compliant material is an adhesive-backed polyester film.

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Dacula, GA, United States of America

Scott Thomas Davies