Other

Lam Research Corporation

Xyratex Technologies, Ltd.

Scott T Petersen

Oliver David Jones

Donald Edgar Stephens

Yassin Mehmandoust

Jonathan E Borkowski

James M Olivas

Kenneth C McMahon

Anthony Cramer Jones

David T Frost

Bryan R Riley

Michael Oxsen

James E Kelley

An aerial application dispersal system that comprises an aerial vehicle and an aerial dispersal unit. The aerial dispersal unit provides an insect control substance, a flake auger, and a motor to drive the flake auger for transporting the insect control substance to a dispensing chamber. The aerial dispersal unit also provides a glue substance, a pump, and a motor to drive the pump for transporting the glue substance from a storage container to the dispensing chamber for mixing with the insect control substance. The dispensing chamber is provided with a motor for forcing the insect control substance mixed with the glue substance out an exit portal for disbursement over the designated area. A control box, control switches, global positioning satellite system, and dispersal unit operator interface are also provided for automatically regulating the mixing and dispensing rate of the insect control substance and glue substance in relation to the ground speed of the aerial vehicle for maintaining a constant, uniform disbursement of a bonded substance over a designated area.

Aerial application dispersal system

Substrate preparation systems comprising multi-zone cascade brush scrubbers having sonic assemblies disposed between one or more of the scrubber zones for cleaning of disk-shaped substrates, including silicon wafers and disks for data storage devices, such as hard disk drives (HDD), compact discs (CD) and digital video discs (DVD). The system method combines a sonic particle dislodgement/removal assembly into a cascade brush scrubber line comprising a longi-tudinal array of brush pairs in which the substrates process through preparation zones defined by each pair of brushes, the substrates being transited longitudinally through the zones while rotating on an axis normal to their faces. Piezoelectric transducer arrays transmit sound energy to one or both face(s) of the substrate to dislodge and/or remove particles, and the scrubber simultaneously or thereafter sweeps away the particulates. The sonic energy may be ultrasonic, megasonic, or both, applied to the substrate surface(s) in alternating or sequential process steps.

Integrated megasonic cascade scrubber module and process

A water sink toy is sized and dimensioned to move and sink in water so as to simulate a squid, or the like. The sink toy includes a shaped, weighted head having an opening formed therein. A number of tentacle-like, floatable elongated members are secured to the head so as to move in water and provide buoyancy to the sink toy. The opening in the head may be used to grasp the head, to enable it to be worn on a finger in the manner of a ring, or to be attached to other objects.

Water sinker toy

A cascaded disk scrubbing system and method are provided. The cascaded disk scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a disk in a vertical orientation through disk preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the disk and to transition the disk in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each disk preparation zone, and the cascaded disk scrubbing system is configured to progress from dirtiest to cleanest as the disk transitions through each disk preparation zone.

Disk cascade scrubber

Liquid is removed from wafers for drying a wafer that has been wet in a liquid bath. The wafer and the bath are separated at a controlled rate as the wafer is positioned in a gas-filled volume. The controlled rate is generally not less than the maximum rate at which a meniscus will form between the liquid bath and the surface of the wafer when the liquid bath and the wafer are separated. The gas-filled volume is defined by a hot chamber that continuously transfers thermal energy to the wafer in the gas-filled volume. Hot gas directed into the volume and across the wafer and out of the volume continuously transfers thermal energy to the wafer.

Wafer drying apparatus and method

A cascaded wafer scrubbing system and method are provided. The cascaded wafer scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a wafer in a vertical orientation through wafer preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the wafer and to transition the wafer in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each wafer preparation zone, and the cascaded wafer scrubbing system is configured to progress from dirtiest to cleanest as the wafer transitions through each wafer preparation zone.

Wafer cascade scrubber

Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates . The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath. The thermal energy transferred to the substrates in the volume evaporates the thin layer from the substrates without decreasing the rate of separation of the substrates and the bath below the maximum rate of such separation at which a meniscus will form between the bath and the surface of one of the substrates during such separation. Relative humidity in the volume is controlled by sensing the relative humidity and regulating the speed of a fan that draws gas from the volume.

Apparatus for drying batches of disks

Liquid is removed from disks by apparatus and methods for drying a disk that has been wet in a liquid bath. The disk and the bath are separated at a controlled rate to form a monolayer of liquid on the disk as the disk is positioned in a gas-filled volume. The separation may be by moving the disk out of the liquid bath, and the controlled rate is generally not less than the maximum rate at which a meniscus will form between the liquid bath and the surface of the disk when the liquid bath and the disk are separated. The gas-filled volume is defined by a hot chamber that continuously transfers thermal energy to the disk in the gas-filled volume. Hot gas directed into the volume and across the disk and out of the volume continuously transfers thermal energy to the disk. The directing of the gas out of the volume is independent of the separation of the bath and the disk. The thermal energy transferred to the disk in the volume evaporates the monolayer from the disk without decreasing the rate of separation of the disk and the bath below the maximum rate of such separation at which a meniscus will form between the bath and the surface of the disk during such separation. In addition to such separation, and directing of the hot gas across the disk and out of the volume, the relative humidity in the volume is kept low to inhibit recondensation of the liquid on the disks.

Disk drying apparatus and method

Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates. The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath. The thermal energy transferred to the substrates in the volume evaporates the thin layer from the substrates without decreasing the rate of separation of the substrates and the bath below the maximum rate of such separation at which a meniscus will form between the bath and the surface of one of the substrates during such separation. Relative humidity in the volume is controlled by sensing the relative humidity and regulating the speed of a fan that draws gas from the volume.

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Los Alamitos, CA, United States of America

Scott T Petersen