Xilinx, Inc.

Other

Scott S Nance

Steven P Young

Bernard J New

James Karp

Patrick J Crotty

Douglas P Sheppard

Richard C Li

Nicholas J Sawyer

Jennifer Wong

Hy V Nguyen

Hassan K Bazargan

Karl I Nordling

Mohammad R Tamjidi

An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.

Hybrid integrated circuit device

Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.

Formation of a hybrid integrated circuit device

A RAM with programmable data port configuration provides for programmable configuration of RAM data ports, and in the case of a multiport RAM, for independent programmable configuration of each data port. A single programmable RAM cell can be utilized in a variety of data port configurations, thereby reducing the number of combinations necessary in a standard cell library or gate array in implement the every possible configuration. In one embodiment of the invention, a dual port RAM is provided with a decoder, an input multiplexer and an output multiplexer for each data port. The input multiplexer for each data port provides several different selectable mappings of a RAM input word of varying sizes to the input bit lines of the respective data port. Similarly, the output multiplexer for each data port provides several different selectable mappings of the RAM output bit lines to the RAM output word. The decoder receives configuration programming bits to determine the appropriate size of the RAM input and output word for the respective port, and based on column addressing bits, outputs a select signal to select the appropriate mapping from the input and output multiplexers. Decoding circuitry is used during RAM write operations to disable those input bits not addressed.

Multiport RAM with programmable data port configuration

A programmable input/output (I/O) circuit for transmitting output signals on or receiving input signals from an I/O terminal, the I/O circuit including a pull-up transistor, a gate bias control circuit and a well bias control circuit, all being connected between Vcc and the I/O terminal. The gate bias control circuit connects the gate of the pull-up transistor to the I/O terminal and the well bias control circuit connects the bulk terminal of the pull-up transistor to the I/O terminal when the I/O circuit is in a 5V tolerant input mode. The gate bias control circuit connects the gate of the pull-up transistor to the system voltage source and the well bias control circuit connects the bulk terminal of the pull-up transistor to Vcc when the I/O circuit is in a PCI compliant input mode. In an output mode, the gate bias control circuit and well bias control circuit allow the pull-up transistor to pull up the I/O terminal to Vcc in response to a pull-up data signal.

Programmable input/output circuit with pull-up bias control

A low voltage interface circuit with a high voltage tolerance enables devices with different power supply levels to be efficiently coupled together without significant leakage current or damage to the circuits. One embodiment of the present invention comprises a tri-state control circuit, a data path, a reference voltage circuit, and an isolation circuit. The interface circuit provides a high impedance receive mode. In this mode, when a voltage is applied to the I/O pin of the interface circuit which is sufficiently greater than the interface circuit power supply voltage, the isolation circuit isolates the power supply from the I/O pin. The interface circuit also protects all of the transistors from gate to bulk, gate to source and gate to drain voltage drops of greater than a specified voltage, for example 3.6V for a nominal 3V power supply when up to 5.5V is being externally applied to the I/O pin. In high impedance mode when the externally applied voltage at the I/O pin is sufficiently below the interface circuit supply voltage, the isolation circuit is driven to approximately the interface circuit supply voltage. In low impedance mode the isolation circuitry is disabled and the logic level at the data terminal is transmitted to the I/O pin. One embodiment of the present invention provides a buffered data path from the data terminal to the I/O pin.

Low voltage interface circuit with a high voltage tolerance

A memory system having a single-sided memory cell, a first voltage supply terminal and a control circuit is provided. The single-sided memory cell has a first node and a second node. Data values are written to the memory cell by selectively applying data signals to the first node or the second node, and data values are read from the memory cell from the second node. The control circuit is coupled to receive a data signal having one of a first state and a second state. The control circuit couples the first node of the memory cell to the first voltage supply terminal when the data signal is in the first state, thereby writing a first data value to the memory cell. The control circuit couples the second node of the memory cell to the first voltage supply terminal when the data signal is in the second state, thereby writing a second data value to the memory cell. Because the first voltage supply terminal is used to write both the first and second data values to the memory cell, problems associated with inadequate write voltages are eliminated by appropriate selection of the first supply voltage.

Single-sided RAM cell and method of accessing same

A RAM with programmable data port configuration provides for programmable configuration of RAM data ports, and in the case of a multiport RAM, for independent programmable configuration of each data port. A single programmable RAM cell can be utilized in a variety of data port configurations, thereby reducing the number of combinations necessary in a standard cell library or gate array to implement the every possible configuration. In one embodiment of the invention, a dual port RAM is provided with a decoder, an input multiplexer and an output multiplexer for each data port. The input multiplexer for each data port provides several different selectable mappings of a RAM input word of varying sizes to the input bit lines of the respective data port. Similarly, the output multiplexer for each data port provides several different selectable mappings of the RAM output bit lines to the RAM output word. The decoder receives configuration programming bits to determine the appropriate size of the RAM input and output word for the respective port, and based on column addressing bits, outputs a select signal to select the appropriate mapping from the input and output multiplexers. Decoding circuitry is used during RAM write operations to disable those input bits not addressed.

A memory device is constructed having a plurality of output ports, each output port being one word wide, such that a plurality of words may be accessed from the memory simultaneously.

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Sunnyvale, CA, United States of America

Scott S Nance