Steag Hamatech, Inc.

First Light Technology, Inc.

First Light Technologies, Inc.

Scott R Parent

Donald G Parent

Joseph W Paulus

Arthur R LeBlanc, Iii

Thomas M Thibault

Kendrick H Light

Guy P Laverriere

Aziz Calcuttawala

Elangovan Ramanatham

Richard W Stowe

Elango Ramanathan

Elangovan Ramanathan

Brian C Rossignol

Peter A Whiteside

Michael L Cadorette

Donald W MacMillan

A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.

System and method for curing a resin disposed between a top and bottom substrate with thermal management

A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.

Method of forming bonded storage disks with low power light assembly

A system and method to maintain concentricity of a center hole of a top substrate and of a bottom substrate in a bonded storage disk manufacturing system. A first device holds a coaxial arrangement of a top and bottom substrate around a first arbor. A second device holding the arrangement in a coaxial arrangement around a second arbor. One of the first and second arbors is fixed to its associated device and the other is movable in response to urging from the one arbor so that the arrangement maintains concentricity.

Method for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk

A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation

System for forming bonded storage disks with low power light assembly

A system and method distribute a resin disposed between a top substrate and a bottom substrate. Each substrate has a center hole, and the top and bottom substrates and the resin define an interior region. A top substrate assembly forms a seal over the center hole of the top substrate and creates a vacuum at the interior region. A bottom substrate assembly receives the top and bottom substrates with the resin disposed in-between. A spinning assembly causes the top and bottom substrates to spin according to a predetermined spin profile.

System and method for distributing a resin disposed between a top substrate and a bottom substrate

System and method for thermally manipulating a combination of a top and

A system and method maintain concentricity of a center hole of a top substrate and of a bottom substrate in a bonded storage disk manufacturing system. A first device holds a coaxial arrangement of a top and bottom substrate around a first arbor. A second device holding the arrangement in a coaxial arrangement around a second arbor. One of the first and second arbors is fixed to its associated device and the other is movable in response to urging from the one arbor so that the arrangement maintains concentricity.

System for maintaining concentricity of a combination of a top and

A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a substrate to be metallized. A circumferentially-arranged rigid ring (27) of predetermined dimensions and location is disposed on the face side and mates with a ring (29) around a port (11) on the wall of the vacuum chamber which surrounds an opening in the wall. Engagement of these rings aligns the platter base (17) relative to the port (11, 12, 13 and 14). A compliant ring (42) is disposed between the wall and the platter base (17). The obverse side of the platter base (17) and the chamber are resiliently forced (37a, 37b, 37c) into contact with each other with a toggling action (24, 22b, 22) whereby to align the platter base (17) relative to the port, to force the outer diameter of the platter base (17) into metal-to-metal contact with the periphery of the port (11), to align the substrate relative to the port (11) and also to force the compliant ring into sealing engagement with the wall, thus, to form a vacuum tight seal.

Metallizing machine

Growing community of inventors

Saco, ME, United States of America

Scott R Parent