International Business Machines Corporation

Scott R Lapree

Stephen Peter Mroz

Howard V Mahaney, Jr

Jason R Eagle

Michael D O'Connell

David Paul Barron

Ray Clement Laning

Matthew Tant Richardson

Christopher William Mann

A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Distributing heatsink load across a processor module with separable input/output (I/O) connectors

A server rack door has a first dimension and a second dimension orthogonal to the first dimension and includes a first group of first obstructions arranged along the first dimension. The first obstructions define a first plurality of flow channels. The server rack door further includes a second group including second obstructions arranged along the first dimension and offset from the first obstructions along the second dimension. The second dimension corresponds to a thickness of the server rack door. The second obstructions define a second plurality of flow channels, where the first obstructions and the second obstructions alternate along the first dimension.

Acoustical noise reduction and distributed airflow in electrical equipment

Acoustic door

Server bezel

Growing community of inventors

Rochester, MN, United States of America

Scott R Lapree