Tooltek Engineering Corporation

Thin Film Electronics Asa

Litrex Corporation

Ulvac, Inc.

Scott R Bruner

Hooshang Jahani

Oleg N Gratchev

Peter F Smith

Arvind Kamath

Charles O Edwards

David Albertalli

Aditi Chandra

Somnath Mukherjee

James N Middleton

Mao Ito

Anand Deshpande

Sambhu Kundu

Howard Walter Bielich

A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.

Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same

A microdeposition system () and method deposits precise amounts of fluid material onto a substrate. A microdeposition head () includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller () includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head () and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like

An apparatus for mounting a sleeve on a spindle includes a frame, and a finger arrangement movably mounted on the frame, the finger arrangement including a plurality of fingers arranged at a common first radius around an imaginary centerline of the finger arrangement, the fingers being movable radially outwardly from the first radius to a second radius upon application of an outwardly directed force. A sleeve having an internal opening in which the fingers are disposed is adapted to be mounted on a stationary spindle by movement of the finger arrangement on the frame toward the spindle. A method for mounting a sleeve on a spindle is also disclosed.

Method for mounting a sleeve on a spindle

Apparatus for mounting a sleeve on a spindle

A fixturing device which supports a substrate or a plurality of substrates in a vertical orientation during cleaning, drying, and coating processing steps while minimizing the contact surfaces between the fixture and each substrate so that a maximum of the substrate surface is exposed. The fixturing device utilizes converging support surfaces that terminate at the closest point in a gap with a distance less than the thickness of a substrate. The converging support surfaces counter surface tension, cohesion of the liquid molecules, and the adhesion of the liquid molecules on the surface of the fixturing device. The gap in the converging support surfaces prevents the fixturing device from retaining liquid at the interface of the substrate and the fixture. In conjunction, the contoured passages enhance the drawing of liquid away from the fixturing device and prevents pooling and staining the substrate. This fixturing device can be implemented in plurality to form two or three dimensional arrays to support a plurality of substrates. The fixturing device can be designed to interface with substrates through an internal aperture, an outer perimeter, or as an end effector on a gripper.

Substrate fixturing device

Growing community of inventors

San Jose, CA, United States of America

Scott R Bruner