Hamilton Sundstrand Corporation

Scott R Bouras

Kris H Campbell

Shin Katsumata

Charles Patrick Shepard

Debabrata Pal

Eric Alan Carter

In accordance with at least one aspect of this disclosure, a power distribution system having integrated cooling includes a chassis defining an interior cavity, an electronics bus structure housed within the interior cavity, and an electrical contactor operatively connected to the electronics bus structure to receive a voltage therefrom. One or more heat dissipation fins can be included extending away from the chassis and configured to dissipate heat from the electronics bus structure to an ambient environment external to the chassis. In embodiments, the electronics bus structure can be sealed within the interior cavity.

Cooling for power distribution systems

An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.

Thermal management for electrical storage devices

A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.

Pin fin heat sink with integrated phase change material and method

A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The heat sink also includes a phase change material sealed within the at least one pin fin to absorb transient thermal loads that the pin fin is subjected to.

A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Thermal management systems for electronics

A semiconductor substrate for use in an integrated circuit, the semiconductor substrate including a channel defined on a surface of the substrate. The channel includes a first wall, a second wall, and a third wall. The first wall is recessed from the surface. The second wall extends from the surface to the first wall. The third wall extends from the surface to the first wall and faces the second wall across the channel. At least one of the second wall and the third wall includes a plurality of structures projecting into the channel from the second wall or the third wall.

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Rockford, IL, United States of America

Scott R Bouras