Qualcomm Incorporated

Scott Powers

Thomas Clark Bryan

Tin Tin Wee

Kenneth Dubowski

Sunil Gupta

Andrew Tohmc

Subrahmanya Pradeep Morusupalli

A wireline communications system is described. The wireline communications system includes a printed circuit board (PCB). The wireline communications system also includes a system on chip (SoC) die on the PCB. The wireline communications system further includes an external memory device coupled to a memory interface of the SoC die. The external memory device is coupled to the memory interface of the SoC die through a PCB trace. A length of the PCB trace is configured according to an operating speed of the memory interface.

Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed

A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.

Programmable pad capacitance for supporting bidirectional signaling from unterminated endpoints

Growing community of inventors

San Diego, CA, United States of America

Scott Powers