Ballard Power Systems Corporation

Scott Parkhill

Fred Flett

Sayeed Ahmed

Douglas K Maly

A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Leadframe-based module DC bus design to reduce module inductance

A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Substrate-level DC bus design to reduce module inductance

An electrical connector for use in a power module includes a first end portion for forming an electrical connection with a substrate, a second end portion, and a compliant portion situated between the first end portion and the second end portion. The compliant portion includes a compressed position and a decompressed position. The first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.

Press (non-soldered) contacts for high current electrical connections in power modules

A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference (&ldquo;EMI&rdquo;). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.

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Perrysburg, OH, United States of America

Scott Parkhill