Murata Manufacturing Co., Ltd.

Psemi Corporation

Murata Manufacturingco., Ltd.

Murata Power Solutions (Milton Keynes) Limited

Scott Parish

Quinn Kneller

Lee Francis

Mark Moffat

Justin Morgan

Simon Charles Denny

Paul Denny

Takayuki Tange

Rohit Sidapara

Jing Wang

Christopher Featherstone

An electronic module includes a substrate or a lead frame including primary conductive patterns and secondary conductive patterns; a magnetic core; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, first terminals that define a first terminal group and that are on or embedded in the resin body, and second terminals that define a second terminal group and that on or are embedded in the resin body; an IC; and a capacitor. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected corresponding secondary conductive patterns; and a first primary conductive pattern is closer to a second primary conductive pattern than any of the secondary conductive patterns.

Block coil

An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.

Method of manufacturing an embedded magnetic component device

An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are covered with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.

A DC-DC converter includes an insulating substrate; a magnetic core embedded in the insulating substrate, the magnetic core having non-zero x, y and z dimensions of less than or equal to about 5.4 mm by about 5.4 mm by about 1.8 mm; separate primary and secondary transformer windings surrounding first and second regions of the magnetic core; and a control circuit including: an oscillator; a drive circuit coupled to the oscillator; and one or more switches coupled to the drive circuit; the drive circuit providing a switching signal to the one or more switches and energizing the one or more switches to provide a drive voltage to the primary transformer winding. The one or more switches are Field Effect Transistors implemented in a Silicon-on-Insulator configuration or as a Silicon-on-Sapphire configuration.

52 cubic millimeter transformer for DC-DC converter device

An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.

Embedded magnetic component device

In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.

An improved electronic oscillator circuit suitable for use in an isolating DC-to-DC converter circuit, and an improved isolating DC-to-DC converter circuit. In one embodiment, an integrated circuit coupled to a transformer includes an oscillator and an output driver. The integrated circuit is preferably fabricated using a silicon-on-insulator technology. The oscillator outputs an alternating pulse signal defined by electrical characteristics of components other than the transformer. The alternating pulse signal is coupled to the output driver, the alternating output of which is coupled to corresponding legs of the primary winding of the transformer. The secondary winding of the transformer provides an electromagnetically coupled isolated output which may be rectified and filtered to produce a DC output voltage. Additional functionality, such as current protection circuitry for the improved circuits, may be readily added to the integrated circuit at little or no increase in cost.

Current protected integrated transformer driver for isolating a DC-DC convertor

An embedded transformer device includes first, second, and auxiliary windings, defined in an insulating substrate by conductive vias joined together by conductive traces. The positions of the conductive vias are arranged to optimize the isolation properties of the transformer and to reduce the coupling of the transformer by increasing the leakage inductance. The embedded transformer device provides better isolation between input side and output side windings, and allows an oscillating LC circuit to be set up in the case of a short circuit, preventing high power from extending between the input and output terminals and thereby avoiding damage to the connected electrical components.

Embedded magnetic component transformer device

An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D. Dand Dare about 0.4 mm or more.

An embedded magnetic component transformer device includes an insulating substrate with a cavity and a magnetic core housed within the cavity. First and second electrical windings pass through the insulating substrate around the magnetic core. The first electrical winding includes a first end terminal and a second end terminal, and a first tap terminal between the first and second end terminals. The device includes circuitry with a first input terminal electrically connected to the first end terminal and a first output terminal. In a first configuration of the circuitry, the first output terminal is electrically connectable to the second end terminal. In a second configuration of the circuitry, the first output terminal is electrically connectable to the first tap terminal.

Multi-tap winding design for embedded transformer

An electrical component for surface mounting, such as a DC-DC power converter includes a body portion including one or more surface mounting pins to connect the body portion to a circuit board, and first and second circuit boards including respective circuit elements mounted thereon. The first and second circuit boards are mounted on the body portion, such that sides of the first and second circuit board on which the circuits are mounted face the interior of the device and the reverse sides of the first and second circuit boards define an exterior surface of the component. In this way, no separate housing for the component is required. The size of the electrical component can therefore be kept small, and protection provided to the circuit elements by the reverse side of the circuit board.

Growing community of inventors

Milton Keynes, United Kingdom

Scott Parish