International Rectifier Corporation

Infineon Technologies Americas Corp.

Scott Palmer

Mark Pavier

Daniel Cutler

Rupert Burbidge

Clive O'Dell

Clive O'dell

According to an exemplary implementation, a power component includes a component substrate and a power semiconductor device electrically and mechanically coupled to the component substrate. The power component also includes at least one first peripheral contact and at least one second peripheral contact situated on the component substrate. A power semiconductor device is situated between the at least one first peripheral contact and the at least one second peripheral contact. The at least one first peripheral contact, the at least one second peripheral contact, and a surface electrode of the power semiconductor device are configured for surface mounting. The at least one first peripheral contact can be electrically coupled to the power semiconductor device.

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Brighton, United Kingdom

Scott Palmer