Adeia Semiconductor Bonding Technologies Inc.

Other

Transocean Sedco Forex Ventures Limited

Vertical Circuits, Inc.

Scott P McGrath

Simon J S McElrea

Scott Jay Crane

Terrence Caskey

Reynaldo Co

Marc E Robinson

Weiping Pan

Grant Villavicencio

Lawrence Douglas Andrews, Jr

DeAnn Eileen Melcher

Suzette Keefe Pangrle

Jeffrey S Leal

Yong Du

De Ann Eileen Melcher

Loreto Cantillep

Hong Shen

Zongrong Liu

Sangil Lee

Keith L Barrie

Elmer M Del Rosario

John R Bray

Brian K Williams

Cyprian Emeka Uzoh

Rajesh Katkar

Charles Gerard Woychik

Liang Wang

Guilian Gao

Arkalgud R Sitaram

Ashok S Prabhu

Kunal Pankaj Shah

Bongsub Lee

Akash Agrawal

Roseann Alatorre

Javier A Delacruz

Nery Hernandez

Joseph Bentitou

Mark Scott

Simon McElrea

Ravi Shenoy

A pre-startup control method for a boiler or water heater includes: providing a controller operatively coupled to a boiler or water heater unit; performing a unit shutdown operation; enabling a pre-start up mode; at about a same time or in any order, moving an air fuel valve by a controller to a non-off position with a gas supply to the water heater or boiler turned off, wherein the controller turns on a blower at an operational level, and causes an ignitor to spark; and displaying parameters which allow an affirmation of a safe and reliable ignition prior to a gas turn on of the boiler or water heater unit. A flow balancing method and a programmed auto run method are also described.

Water heater and boiler processes

A method of processing an interconnection element can include providing a substrate element having front and rear opposite surfaces and electrically conductive structure, a first dielectric layer overlying the front surface and a plurality of conductive contacts at a first surface of the first dielectric layer, and a second dielectric layer overlying the rear surface and having a conductive element at a second surface of the second dielectric layer. The method can also include removing a portion of the second dielectric layer so as to reduce the thickness of the portion, and to provide a raised portion of the second dielectric layer having a first thickness and a lowered portion having a second thickness. The first thickness can be greater than the second thickness. At least a portion of the conductive element can be recessed below a height of the first thickness of the second dielectric layer.

Methods and structures to repair device warpage

A microelectronic assembly includes a stack of semiconductor chips each having a front surface defining a respective plane of a plurality of planes. A chip terminal may extend from a contact at a front surface of each chip in a direction towards the edge surface of the respective chip. The chip stack is mounted to substrate at an angle such that edge surfaces of the chips face a major surface of the substrate that defines a second plane that is transverse to, i.e., not parallel to the plurality of parallel planes. An electrically conductive material electrically connects the chip terminals with corresponding substrate contacts.

Flipped die stack

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Semiconductor die mount by conformal die coating

A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions of at least some of the wire bonds can have bends that change an extension direction of the respective wire bond. The reinforcing dielectric layer can have protruding regions surrounding respective ones of the wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions. The peak heights of the protruding regions can coincide with points of contact between the reinforcing dielectric layer and individual wire bonds.

Stiffened wires for offset BVA

Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Electrical connector between die pad and z-interconnect for stacked die assemblies

Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure.

Stacked die assembly having reduced stress electrical interconnects

A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.

Vertical electrical interconnect formed on support prior to die mount

In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

Electrically interconnected stacked die assemblies

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

An apparatus to allow backup or alternate fluid flow routes around malfunctioning BOP control components using a remotely installed removable hydraulic hose connection. The backup fluid flow route sends pressure-regulated hydraulic fluid to a BOP operation via an isolation valve rigidly attached to the BOP, then to a hose connected to an intervention panel on the BOP and finally through a valve that isolates the primary flow route and establishes a secondary flow route to allow continued operation. To increase reliability, the backup components route from a spare BOP function and are rigidly fixed to the BOP.

System and method for providing additional blowout preventer control redundancy

Growing community of inventors

Sugar Land, TX, United States of America

Scott P McGrath