Raytheon Company

Scott Mitchel Heston

John G Heston

Brian P Helm

David D Heston

Mikel J White

Cary C Kyhl

James M Elliott

Gordon R Scott

William Sheridan Kopp

David R Fletcher

A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Method to align surface mount packages for thermal enhancement

In accordance with the teachings of the present invention, a method and apparatus for increasing the efficiency of electrical systems are provided. In a particular embodiment, the apparatus comprises a first electrical component including a self-biasing resistor and at least one input terminal coupled to a power supply, and a second electrical component including at least one input terminal coupled to an output terminal of the first electrical component, and an electrical short circuit connected across the self-biasing resistor in the first electrical component such that current from the power supply bypasses the self-biasing resistor.

Method and apparatus for increasing efficiency of electrical systems

A power amplifier includes amplifier stages. An amplifier stage includes a transistor, and at least one amplifier stage comprises a driver stage. The amplifier stages include a first amplifier stage having a first transistor and associated with a first output power, and a second amplifier stage having a second transistor and associated with a second output power. A current sharing coupling couples the first amplifier stage and the second amplifier stage. The first amplifier stage and the second amplifier stage share a current through the current sharing coupling. The current sharing coupling facilitates scaling of the first output power and the second output power.

Amplifying a signal using a current shared power amplifier

According to one embodiment of the present invention, an amplifier includes an amplifying transistor coupled to a ground and operable to amplify a received signal. One or more bias components provide a bias resistance for the amplifying transistor. The one or more bias components include a control modulator coupled in series between the amplifying transistor and the ground. The control modulator receives a control signal and modulates the amplifying transistor in response to the control signal.

Amplifying a signal using a control modulator that provides a bias resistance

According to one embodiment of the present invention a method for biasing a power amplifier having at least one transistor exhibiting kink anomaly includes providing a bias circuit coupled to a gate of at least one transistor of the power amplifier. The method also includes providing, by the bias circuit, a bias voltage to the gate. The bias circuit has a load characteristic that intersects a current versus gate voltage curve for the gate at a frequency of operation of the power amplifier only once and that exhibits a low impedance at the intersection of the load characteristic with the current versus gate curve of the gate.

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Dallas, TX, United States of America

Scott Mitchel Heston