International Business Machines Corporation

Scott Matthew Hargash

Pavel Smetana

Joseph P DeGeorge

William Robert Copeland

Robert S Young

Matthew F Stanton

Gregory S Boettcher

William T Petry

Bryant L Hancock

Joseph Casaregola

Kevin R Geysen

A system and method for detecting leaks in pressurized or vacuum pipes is disclosed. A pipe clamp comprises a housing that surrounds a pipe fitting. A containment chamber within the pipe clamp prevents leaked gas from escaping into the environment. The pipe clamp is installed in series with an exhaust line to remove the leaked gas from the containment chamber. A sensor may be configured and disposed to detect a change in pressure in the containment chamber to indicate the occurrence of a leak.

Pipe monitoring system and method

An apparatus for implementing an emergency machine off circuit of a fabrication system, includes: at least one safety switch adapted for shunting an operation enable signal from a piece of equipment selected for removal from service, the switch also removing from service supplemental devices for the selected equipment. A semiconductor fabrication system and a method for removing equipment from service are provided.

Emergency machine off feature with safety control interface

An apparatus which allows tightly coupling of the device wafer to the electrostatic chuck of the process chamber after the process chamber is conditioned. The apparatus includes (a) a process chamber; (b) a chuck in the process chamber; (c) a guard wafer placed on and in direct physical contact with the chuck; and (d) a particle restraining layer on essentially all surfaces that are exposed to the ambient inside the process chamber. The particle restraining layer has a thickness in a first direction of at least 500 nm. The first direction is essentially perpendicular to an interfacing surface between the particle restraining layer and the chuck. The guard wafer comprises a material selected from the group consisting of a metal and a semiconductor oxide.

Guard wafer for semiconductor structure fabrication

An apparatus (and method for operating the same) which allows tightly coupling the device wafer to the electrostatic chuck of the process chamber after the process chamber is conditioned. The method comprises (a) providing (i) a process chamber and (ii) an electrostatic chuck in the process chamber; (b) placing a guard wafer on the electrostatic chuck via a top surface of the electrostatic chuck; and (c) forming a particle restraining layer on essentially all surfaces that are exposed to the ambient inside the process chamber, wherein the particle restraining layer has a thickness in a first direction of at least 500 &#x212b;, wherein the first direction is essentially perpendicular to an interfacing surface between the particle restraining layer and an inner surface of the process chamber, and wherein the guard wafer comprises a material selected from the group consisting of a metal and a semiconductor oxide.

Growing community of inventors

Kingston, NY, United States of America

Scott Matthew Hargash