Intel Corporation

Scott L Noble

Daryl James Nelson

Yun Ling

Lloyd L Pollard, Ii

Steve J Lofland

Seri Lee

John M Lynch

Yinan Wu

James S Webb

Daniel Willis

Ed J Unrein

Bill W Carter

Robert A Eldridge

Guixiang Tan

Murli Tirumala

Thai (Daniel) Tong

David L Brown

Brent A Hill

Cary D Cottrell

Daniel L Tong

An electronic system includes a system board, a connector mounted on the system board, an electronic card attached to the connector, the card overhanging the connector at least on an inward end of the card, and a guide secured to the system board and spaced from the connector, wherein the guide is adapted to inhibit lateral movement of the card. The guide includes a latch adapted to inhibit removal of the electronic card from the connector.

Multi-axis retention mechanism

In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.

Method, apparatus and system for enclosure enhancement

An apparatus includes a socket and a dynamic random access memory (DRAM) module installed in the socket.

Multi-slot socket for mounting integrated circuits on circuit board

In one embodiment of the invention, the apparatus includes a socket connector. In one embodiment of the invention, the socket connector is to connect to a circuit board. The socket connector includes a housing to contain contacts, a socket disposed within the housing to receive an add-in card, and a retaining tab coupled to the housing to retain the add-in card in the socket. The retaining tab includes a lobe to mate with a retaining notch of the add-in card.

Integrated add-in card retention mechanism

An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.

Integrated heat sink for different size components with EMI suppression features

A cooling assembly is disclosed. In one embodiment, the cooling assembly includes a fan for use to direct cool air onto heat dissipating electronic components, and a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan. The linear air guiding duct-housing combination is constituted with material(s) and/or structural supports that allow the cooling assembly to be mounted in a cantilever manner against a chassis wall of a chassis, overhanging the heat dissipating electronic components. In one embodiment, the cooling assembly further includes an air hood coupled to the linear air guiding duct-housing combination to facilitate in-take of cool air from a direction angular to the linear air guiding duct-housing combination.

Fan duct module

A socket attaches to a first component and includes a receptive area to couple a second component to the first component. A low profile voltage regulator is integrated into the socket and proximately disposed adjacent to the receptive area. The low profile voltage regulator converts a first power signal from the first component to a second power signal for the second component. A chassis encloses the socket and the low profile voltage regulator and serves as a base for a heat sink to be attached to the second component.

Integrated circuit socket having a built-in voltage regulator

A printed circuit card retention mechanism is presented that maintains electrical connection by securing an electrical connector of a printed circuit card to an electrical connector of a main circuit board in a piece of electronic equipment. The retention mechanism has a base and at least one pivot arm extending from the base. The base fastens directly onto (i.e., fits over) the electrical connector of the main circuit board. The at least one pivot arm has a finger that extends towards the printed circuit card and fits into notches either cut into or cut through the printed circuit card. While the connector on the printed circuit card is electrically mated to a connector mounted on the main circuit board, the fingers of the retention mechanism latch into notches located on the printed circuit card to ensure the electrical connection between the printed circuit card and main circuit board is maintained when physically moving the piece of electronic equipment.

Printed circuit card retention mechanism

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.

An audio I/O connector, a flex cable, an audio I/O extension card, a mounting bracket, and a besel, designed to couple and complement each other in a particular geometrical manner, are provided to conduct I/O of audio signals at the front panel area of a Baby-AT/LPX and the like system unit previously sealing the hard drive bay. The audio I/O connector reorients an otherwise conventional audio add-in/adapter card to conduct I/O of audio signals through the frontal portion of the Baby-AT/LPX and the like system unit. The flex cable transports the audio I/O signals to and from the front and back portions of the Baby-AT/LPX and the like system unit. The audio I/O extension card facilities conduct of audio I/O with external audio devices at the front panel, the aforementioned area in particular. The mounting bracket secures the audio I/O extension card to the hard drive bay. The besel exposes audio I/O ports of the audio I/O extension card at the front panel area of interest.

Front panel audio I/O apparatus for personal computer systems

A hard disk drive carrier that is inexpensive to manufacture and suitable for use with hot plug connected hard disk drives. A composite ventilated bay secures the disk drive while an interlocking handle mechanism provides the carrying functionality for the hard disk drive carrier as well as the hardware for one-hand locking and unlocking of the carrier within a hard disk drive chassis.

Portable disk drive carrier and chassis

A collapsible heat sink for cooling heat generated by components in a computer system. The heat sink is positioned in an open space formed between a base casing and a bottom cover of the computer system. The heat sink comprises folding fins and cold plates made of conductive surfaces. When the heat sink is in an open position, the folding fins are in an extended position. In the open position, the heat sink exposes the conductive surfaces including the cold plates and the folding fins in the extended position, thereby dissipating the heat generated by the components of the computer system. In a collapsed position of the heat sink, the folding fins are folded. In the collapsed position, the heat sink fits in a minimal space formed between the bottom cover and the base casing of the computer system. As a result, the heat sink consumes minimal additional space.

Growing community of inventors

Beaverton, OR, United States of America

Scott L Noble