Adeia Semiconductor Bonding Technologies Inc.

Other

Hewlett-packard Company

Candescent Technologies Corporation

Coherent, Inc.

Vertical Circuits, Inc.

Scott Jay Crane

Scott P McGrath

Simon J S McElrea

Marc E Robinson

Weiping Pan

Terrence Caskey

Lawrence Douglas Andrews, Jr

DeAnn Eileen Melcher

John D Porter

Reynaldo Co

Stephanie Jeanne Oberg

Zongrong Liu

Grant Villavicencio

Yong Du

Anthony W Johnson

De Ann Eileen Melcher

Loreto Cantillep

Christopher J Spindt

Bob Lee Mackey

John M Macaulay

George B Hopple

Anthony P Hoult

Jack D Porter

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Semiconductor die mount by conformal die coating

In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

Electrically interconnected stacked die assemblies

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

Wafer level surface passivation of stackable integrated circuit chips

A method of encapsulating an integrated-circuit component supported on a substrate comprises depositing on the component a thermally curable liquid organic matrix in sufficient quantity to form a layer covering the component. The liquid matrix layer is irradiated by laser radiation having a wavelength between about 600 and 1000 nanometers. The liquid matrix includes one or more additive materials that are strongly absorbing for the wavelength of the laser radiation. The liquid matrix layer is irradiated with the laser radiation for a time period sufficient to cure the matrix layer.

Diode-laser curing of liquid epoxide encapsulants

A liquid chemical formulation suitable for making a thin solid polycarbonate film of highly uniform thickness is formed with polycarbonate material, a liquid that dissolves the polycarbonate, and possibly one or more other constituents. The liquid is typically capable of dissolving the polycarbonate to a concentration of at least 1% at 20&deg; C. and 1 atmosphere. The liquid also typically has a boiling point of at least 80&deg; C. at 1 atmosphere. Examples of the liquid include pyridine, a ring-substituted pyridine derivative, pyrrole, a ring-substituted pyrrole derivative, pyrrolidine, a pyrrolidine derivative, and cyclohexanone. In forming the polycarbonate-containing film, a liquid film (,A) of the liquid chemical formulation is formed over a substructure (,). The liquid film is processed to largely remove the liquid and convert the polycarbonate into a solid film (,).

Polycarbonate-containing liquid chemical formulation and method for making polycarbonate film

A component (10 or 12) of a flat-panel display is cleaned with a fluid having a mole-fraction dominant constituent. The cleaning operation is performed by subjecting the component to the cleaning fluid while its absolute pressure exceeds the absolute pressure at the triple point of the dominant constituent and is at least 20% of the absolute pressure value at the critical point of the dominant constituent. The temperature and pressure of the cleaning fluid are typically controlled in a direction toward the supercritical state of the dominant constituent.

Cleaning of flat-panel display

A technique for creating openings in a polycarbonate film entails providing a liquid chemical formulation that contains polycarbonate material, a liquid that dissolves the polycarbonate, and possibly one or more other constituents. The liquid is typically capable of dissolving the polycarbonate to a concentration of at least 1% at 20.degree. C. and 1 atmosphere. Examples of the liquid include pyridine, a ring-substituted pyridine derivative, pyrrole, a ring-substituted pyrrole derivative, pyrrolidine, a pyrrolidine derivative, chlorobenzene, and cyclohexanone. A liquid film (36A) of the chemical formulation is formed over a substructure (30) and processed to remove the liquid, thereby converting the liquid film into a solid polycarbonate track layer (38). Charged particles (70) are passed through the track layer to form charged-particle tracks (72) at least partway through the layer. Apertures (74) are created through the track layer by a process that entails etching along the tracks. The aperture-containing polycarbonate track layer is typically employed in fabricating a gated electron-emitting device.

Formation of polycarbonate film with apertures determined by etching

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Aromas, CA, United States of America

Scott Jay Crane