Intel Corporation

Altera Corporation

Tabula, Inc.

Scott J Weber

Aravind Raghavendra Dasu

Ravi Prakash Gutala

Sean R Atsatt

Kevin Clark

Mahesh A Iyer

Eriko Nurvitadhi

James Loran Ball

Jun Pin Tan

Alpa Narendra Trivedi

Steffen Schulz

Patrick Koeberl

Archanna Srinivasan

Steven L Teig

Robert L Sankman

Debendra Mallik

Andrew Edward Caldwell

Ravindranath Vithal Mahajan

Rajat Agarwal

Dheeraj R Subbareddy

Md Altaf Hossain

Ankireddy Nalamalpu

Ram S Viswanath

Sandeep B Sane

Ilya K Ganusov

Sriram Srinivasan

Christopher D Ebeling

Shangzhi Sun

Hung Q Nguyen

Shilpa V Yeole

Timothy J Callahan

Martin Langhammer

Andrew Martyn Draper

Simon S Chong

Yi Peng

David Samuel Goldman

Herman Henry Schmit

Jawad Basit Khan

Gregg William Baeckler

Arifur Rahman

Randy Renfu Huang

Chee Hak Teh

Richard L Coulson

Ashish Gupta

Albert Fazio

Sergey Vladimirovich Gribok

Kevin Nealis

Ting Lu

Farhana Sheikh

Gary Brian Wallichs

David J Greenhill

Carl Ebeling

Thiam Khean Hah

Kalen Brunham

Matthew I Adiletta

Vamsi Nalluri

Steve Tuyen Vu

Parivallal Kannan

Gregory Steinke

Furkan Turan

Terence Magee

David Goldman

Aman Gupta

Sumeet Singh Nagi

Uneeb Yaqub Rathore

An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

Multi-purpose interface for configuration data and user fabric data

An apparatus to facilitate enabling secure state-clean during configuration of partial reconfiguration bitstreams on accelerator devices is disclosed. The apparatus includes a security engine to perform, as part of a PR configuration sequence for a new partial reconfiguration (PR) persona corresponding to a PR bitstream, a first clear operation to clear previously-set persona configuration bits in the region; perform, as part of the PR configuration sequence subsequent to the first clear operation, a set operation to set new persona configuration bits in the region; and perform, as part of the PR configuration sequence, a second clear operation to clear memory blocks of the region that became unfrozen subsequent to the set operation.

Enabling secure state-clean during configuration of partial reconfiguration bitstreams on FPGA

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.

Interconnect architecture with silicon interposer and EMIB

A circuit system includes a power control circuit that generates multiple voltage identifiers. Multiple voltage regulator circuits generate multiple supply voltages based on the voltage identifiers. The supply voltages are provided to multiple integrated circuit dies. The power control circuit varies the voltage identifiers based on changes in metrics associated with the integrated circuit dies to cause the voltage regulator circuits to vary the supply voltages. Integrated circuit dies receive supply voltages from voltage regulator circuits through power delivery networks. The integrated circuit dies provide voltage sense signals that indicates the supply voltages. The voltage regulator circuits adjust the supply voltages based on the voltage sense signals to compensate for voltage drops in the power delivery networks.

Supply voltage control systems and methods for integrated circuits

This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

System-in-package network processors

Methods and apparatus for extracting a setting of configuration bits to create an exclusion configuration for providing protection against peek and poke attacks in a multi-tenant usage model of a configurable device is provided. The device may host multiple parties that do not trust each other. Peek and poke attacks are orchestrated by tapping (peeking) and driving (poking) wires associated with other parties. Such attacks may be disabled by excluding the settings of configuration bits that would allow these attacks by other parties. This set of configuration bits that should be excluded for preventing all peek and poke attacks creates the exclusion configuration. Methods are described that disable a particular class of peek and/or poke attacks through the use of partial reconfiguration. Methods and apparatus are described to dynamically detect peek and/or poke attacks.

Integrated circuit with peek and poke protection circuitry for multi-tenant usage model

A circuit system includes a first integrated circuit die having a first group of circuits configured to perform a first set of operations. The circuit system also includes a second integrated circuit die having a second group of circuits configured to start performing a second set of operations with a delay after the first group of circuits starts performing the first set of operations to reduce power supply voltage droop. The operations performed by the first and second groups of circuits can be interleaved with a fixed or a variable delay. Logic circuits can be partitioned into the first and the second groups of circuits based on predicted switching activity of the logic circuits. Decoupling capacitors in integrated circuit dies can be coupled together to reduce droop in a supply voltage during a high current event.

Circuit systems and methods for reducing power supply voltage droop

A circuit system includes a first voltage regulator circuit that generates a first supply voltage for an integrated circuit die based on a first control signal. The first voltage regulator circuit generates a first feedback signal based on the first supply voltage. The circuit system also includes a second voltage regulator circuit that generates a second supply voltage for an integrated circuit die based on a second control signal. The second voltage regulator circuit generates a second feedback signal based on the second supply voltage. The circuit system also includes a third voltage regulator circuit that generates the first control signal based on the first feedback signal and the second control signal based on the second feedback signal. The circuit system may include fully integrated, on-board, and on-package voltage regulator circuits.

Voltage regulator circuit systems and methods

An integrated circuit device may include programmable logic circuitry on a first integrated circuit die and memory that includes compute-in-memory circuitry on a second die. The programmable logic circuitry may be programmed with a circuit design that operates on a first set of data. The compute-in-memory circuitry of the memory may perform an arithmetic operation using the first set of data from the programmable logic circuitry and a second set of data stored in the memory.

Compute-in-memory systems and methods

Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.

Micro-network-on-chip and microsector infrastructure

An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.

Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems

An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.

Fast memory for programmable devices

Systems and methods described herein may relate to providing a dynamically configurable circuitry able to process data associated with a variety of matrix dimensions using one or more complex number operations, one or more real number operations, or both. Configurations may be applied to the configurable circuitry to program the configurable circuitry for a next operation. The configurable circuitry may process data according to a variety of operations based at least in part on operation of a repeated processing element coupled in a compute network of processing elements.

Reconfigurable digital signal processing (DSP) vector engine

Growing community of inventors

San Jose, CA, United States of America

Scott J Weber