Rockwell Collins, Inc.

Scott J Sellner

Steve I Lebo

James B West

Jeremiah Damien Wolf

Eric D Baldwin

An antenna assembly includes a plurality of RF card assemblies, a backplane circuit board, a plurality of connectors, and a chassis. Each of the RF card assemblies includes a circuit board having a number of antenna elements. The backplane circuit board includes a top surface with at least one set of power supply rails. The connectors are arranged in rows along a top surface of the backplane circuit board. Each of the connectors has an inlet configured to receive one of the RF card assemblies along a plane perpendicular to the top surface of the backplane circuit board. The bottom surface includes power supply pins configured to engage the power supply rails. The chassis is configured to enclose the backplane circuit board, the RF card assemblies, and the connectors.

Modular antenna array system with thermal management

A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.

Ruggedized electronic module cooling system

A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronic subsystem device. The housing is environmentally sealed. The ruggedized electronics module also includes a module restraint extending from the housing the restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom.

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Marion, IA, United States of America

Scott J Sellner