Palo Alto Research Center Inc.

Xerox Corporation

Leidos, Inc.

Scott J Limb

Rene A Lujan

Christopher L Chua

William S Wong

Qian Wang

Gregory Lewis Whiting

Eric J Shrader

Michael L Chabinyc

Sean Roark Garner

Sylvia Joan Smullin

Uma Srinivasan

Beverly Russo

David Mathew Johnson

Francisco Eduardo Torres

Jeng Ping Lu

Jengping Lu

Saroj Kumar Sahu

John Steven Paschkewitz

Meng H Lean

Steven E Ready

Daniel Lynn Larner

Sanjiv Sambandan

Norine E Chang

Kathryn F Murphy

Clark Crawford

Dirk De Bruyker

Brent Shawhan Krusor

Huangpin Ben Hsieh

Scott Eugene Solberg

Christopher A Paulson

Armin Rainer Völkel

Bryan Thomas Preas

Julie A Bert

Kirt Williams

Eric Cocker

Jeonggi Seo

Ashutosh Kole

Jürgen H Daniel

Erica Ronchetto

C Wayne Jaeger

David Matthew Johnson

Steven Neltner

Patrick Murphy

Kris Schmidt

Clark W Crawford

David Stephen White

An apparatus includes a structure comprising a predetermined breakable region and a mechanical actuator disposed at or proximate the predetermined breakable region. The mechanical actuator comprises an impact member coupled to a spring arrangement, and a restraint member operably coupled to the spring arrangement. A trigger source is operably coupled to an electrical power source. The trigger source, in response to receiving current from the electrical power source, is configured to release or break the restraint member so as to allow the spring arrangement to forcibly move the impact member into contact with, and break, the predetermined breakable region.

Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels

An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.

Apparatus and method for creating crack initiation sites in a self-fracturing frangible member

A device includes at least one stress-engineered portion and at least one second portion. The stress-engineered portion includes at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The tensile stress layer and the compressive stress layer are mechanically coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. The stress-engineered portion is configured to fracture due to propagating cracks generated in response to energy applied to the stress-engineered portion. Fracture of the stress-engineered portion changes functionality of the device from a first function to a second function, different from the first function.

Functionality change based on stress-engineered components

A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.

Decoy security based on stress-engineered substrates

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

Self-limiting electrical triggering for initiating fracture of frangible glass

A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

Method of forming a photodiode

Sensor and heater for stimulus-initiated fracture of a substrate

A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

Circuit interconnect system and method

A method of making a substrate involves patterning the substrate into active areas and dicing lanes. After the substrate is patterned one or more stress layers are formed the substrate. A change in stress along a thickness of the substrate in the active areas is larger than a change in stress along the thickness of the substrate in the dicing lanes. The substrate is subsequently diced along the dicing lanes.

Singulation of ion-exchanged substrates

A thermionic sensor is disclosed. The sensor includes a sensor housing at least partially defining an emission chamber in which at least a partial vacuum is maintained; a cathode disposed in the emission chamber; an anode disposed in the emission chamber and spaced apart from the cathode; and an electrically conductive layer disposed in the emission chamber facing the anode and cathode. The thermionic sensor is configured to output a detection signal when the anode and cathode are at substantially the same temperature.

Wireless thermionic sensor

A thermionic sensor package and methods of using the same are disclosed. The sensor package includes a substrate, a package housing disposed on the substrate and at least partially defining a package chamber in which vacuum conditions are maintained, a thermionic sensor disposed in the package chamber, and a wireless transmission device disposed on the substrate. The thermionic sensor includes a sensor housing at least partially defining an emission chamber, a cathode disposed in the emission chamber, an anode disposed in the emission chamber and spaced apart from the cathode, and an electrically conductive layer disposed in the emission chamber facing the anode and cathode. The method includes generating a detection signal when the anode and the cathode of the sensor are at substantially the same temperature.

Wireless thermionic sensor package and methods of using

An article includes a support substrate bonded to heterostructure epitaxial layers that include one or more electronic devices. The support substrate has a bonding surface and the heterostructure epitaxial layers have a surface with the epitaxial growth direction of the heterostructure epitaxial layers towards the surface. The surface of the heterostructure epitaxial layers is bonded at the bonding surface of the support substrate by ion exchange between the surface of the heterostructure epitaxial layers and the bonding surface of the support substrate.

Integration of semiconductor epilayers on non-native substrates

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Palo Alto, CA, United States of America

Scott J Limb