Apple Inc.

Scott J Campbell

Bartley K Andre

Brett W Degner

Michael D McBroom

Houtan R Farahani

Michael E Leclerc

Eric R Prather

Stephen Vincent Jayanathan

James M Cuseo

Danny L McBroom

Ian A Guy

Daniel David Hershey

Mariel L Lanas

David C Parell

Helia Rahmani

Rodrigo Dutervil Mubarak

Christian Kettenbeil

Vineet Negi

Stephane J Marcadet

Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

Compression structures for IC packages

Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

High-capacity computer modules

Growing community of inventors

Sunnyvale, CA, United States of America

Scott J Campbell