Bridgelux Incorporated

Curon Medical, Inc.

Mederi Therapeutics, Inc.

Neotract, Inc.

Medtronic, Inc.

Medtronic Cardiorhythm

Barrx Medical, Inc.

Intematix Corporation

Medtronics, Inc.

Respiratory Diagnostic, Inc.

Apmed Solutions, Inc.

Scott H West

John W Gaiser

David S Utley

Jay J Qin

Joshua Makower

Theodore Charles Lamson

Joseph Catanese, Iii

Russell J Redmond

Claude A Vidal

Michael Collinson

Daniel Merrick

Amik Nagpurkar

Babak Imangholi

Vladimir Odnoblyudov

Jacqueline Nerney Welch

Richard G Vecchiotti

Patrick Rimroth

Khashayar Phil Oliaei

Cem Basceri

Zhengqing Gan

Jay Chin

Rachel Croft

Wenhui Zhang

Xiaolu Chen

David Huynh

Robin B Bek

Mitchell C Barham

Tao Tong

Larry C Heaton, Ii

Matt McLean

Mike Kwon

Richard S Jaraczewski

Jesus Del Castillo

David Huyhn

Gerry Keller

Peter H Muller

Frank Nguyen

Ronald G Lax

Amir Abolfathi

Matthew McLean

Csaba Truckai

Aurelio Valencia

Peter M Breining

Christopher Lolachi

John H Ford

Joseph Catanese Iii

Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

LED array package

A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.

Optics for chip-on-board road and area lighting

Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

Die emitting white light

A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

Light-emitting device with reflective ceramic substrate

A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Substrate free LED package

Growing community of inventors

Livermore, CA, United States of America

Scott H West