Micron Technology Incorporated

Scott Gooch

Richard W Wensel

Joseph M Brand

In one aspect, the invention includes a method of encapsulating a semiconductor device, comprising: a) providing a semiconductor device; b) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; and c) dispensing a liquid encapsulating material through the plurality of orifices and over the semiconductor device. In another aspect, the invention includes a method of forming an electronic package, comprising: a) providing a circuit board having a circuit pattern; b) joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern; c) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices; d) simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices; and e) curing the liquid encapsulating material.

Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages

The present invention provides a ball grid array (&ldquo;BGA&rdquo;) assembly and process of manufacturing for reducing warpage caused by the encapsulation of the associated semiconductor chip. The assembly and process includes coupling a substrate between a semiconductor chip and a BGA structure; attaching a stabilizing plate to the substrate adjacent the BGA structure; and encapsulating the semiconductor chip.

Method and apparatus for reducing BGA warpage caused by encapsulation

Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices

Semiconductor device encapsulators

The present invention provides a ball grid array (&ldquo;BGA&rdquo; ) assembly and process of manufacturing for reducing warpage caused by the encapsulation of the associated semiconductor chip. The assembly and process includes coupling a substrate between a semiconductor chip and a BGA structure; attaching a stabilizing plate to the substrate adjacent the BGA structure; and encapsulating the semiconductor chip.

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Boise, ID, United States of America

Scott Gooch