International Business Machines Corporation

Dais Corporation

Adeia Semiconductor Bonding Technologies Inc.

Sono-tek Corporation

Scott G Ehrenberg

Thomas H DiStefano

Gary E Wnek

Joseph M Serpico

Igor Y Khandros

Janet L Poetzinger

Jeffrey N Rider

Jae M Park

Ekkehard F Miersch

L Wynn Herron

Timothy N Tangredi

Paul Alan

Elizabeth J Wohlford

Fuel cells incorporating a novel ion-conducting membrane are disclosed. The membrane comprises a plurality of acid-stable polymer molecules each having at least one ion-conducting component covalently bonded to at least one flexible connecting component. The membrane has ion-conducting components of the polymer molecules ordered such that a plurality of continuous ion-conducting channels penetrate the membrane from a first face to a second face and such that the ion-conducting channels are situated in an elastic matrix formed by the flexible connecting components. A preferred membrane is obtained by (1) sulfonating SEBS with sulfur trioxide under conditions that result in greater than 25 mol % sulfonation and (2) heating the polymer.

Fuel cell incorporating novel ion-conducting membrane

A gas diffusion electrode for an electrochemical cell and a fuel cell employing the electrode are disclosed. The electrode includes a porous body in contact with a catalyst layer comprising (i) a catalyst dispersed on the surface of a carbon support; (ii) a water-insoluble sulfonated polystyrene, poly(.alpha.-methylstyrene) or SEBS block copolymer; and (iii) a nonionic fluorocarbon polymer. The fuel cell includes two of the foregoing electrodes and a membrane of a proton-conducting polymer between the electrodes. It also includes an inlet for a gaseous fuel, an inlet for an oxygen-containing gas, and an outlet for reaction products.

Gas diffusion electrode

A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials at locations other than the interconnect locations. Excess materials are captured in reservoirs such as within vias in the circuit panels and apertures in interior elements within the interposers. The flowable materials of the interposers, together with the reservoirs, allow the interposers to compress and take up tolerances in the components. The flowable dielectric material encapsulates conductors on the surfaces of the circuit panels.

Multi-layer circuit structures, methods of making same and components

Method of making a multi-layer circuit assembly

A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulated foil (10) which has been patterned with holes (12). Metallization patterns on the surfaces of the compensator (20) provide orthogonal wiring (22), electrical connections (24) to the foil (10), and electrical connections (26) between the top and bottom surfaces. The capping layer (32) includes joining metallurgy (38) at selected locations within a dielectric layer (36) that is in registry with the metallization in the vias (16). The joining metallurgy (38) may be a metal loaded thermoplastic and provides a seal for the vias (16) as well as planarizes the structure. The capping layers (32) may be formed in-situ on the compensator or separately.

Discrete fabrication of multi-layer thin film, wiring structures

An apparatus and method generates a stream of atomized fluid for applying a substantially uniform coating of atomized fluid to a surface, such as the application of a liquid flux coating to circuit boards. An ultrasonic atomizer discharges a conical spray pattern of atomized fluid, and an air horn discharges a stream of air intersecting the path of the atomized stream of fluid for entraining the atomized stream of fluid within the stream of air. Two air jets are located on either side of the ultrasonic atomizer relative to each other, and each discharges a low pressure jet of air in a direction substantially opposite to the direction of the other. Each jet of air in turn shears the conical spray pattern of atomized fluid into a respective plume of atomized fluid. The two plumes of atomized fluid are then entrained into the moving sheet of air discharged by the air horn, thus forming a substantially uniform linear dispersion of atomized fluid for coating a surface with the atomized fluid.

Apparatus and method for applying a stream of atomized fluid

A structure and process for forming dense multi-layer thin film structures wherein individual layers of thin film wiring which can be pre-inspected and then laminated one on top of the next to form a three dimensional wiring matrix are disclosed.

Metal transfer layers for parallel processing

A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors on polyimide film layers, involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

Growing community of inventors

Fishkill, NY, United States of America

Scott G Ehrenberg