Kionix, Inc.

Cornell Research Foundation Inc.

Mezmeriz, Inc.

Other

Calient Networks, Inc.

Milli Sensor Systems+actuators

Scott G Adams

Kevin A Shaw

Noel C MacDonald

Scott A Miller

Charles W Blackmer

Shahyaan Desai

Clifford A Lardin

Tim Davis

John Matthew Chong

Timothy J Davis

Kristin J Lynch

Russell Y Webb

Bryan Walter Reed

Andrew J Minnick

Seung Bok (Chris) Lee

Mollie K Devoe

Donato Cardarelli

Paul C Waldrop

Andrew Hocking

Charles R Dauwalter

James E Strait

Hercules Neves

Raymond Carroll

John M Chong

James S Thorp

June Shen-Epstein

Nathan L Stirling

Keith Epstein

Yongmei Cindy Wang

Luke E DeWalt

Seung (Chris) Bok Lee

Fred M Bertsch

Ashish A Shah

Wendy Jo H Johnson

Wolfgang M J Hofmann

James Groves

Andrew S Hocking

Russel Y Webb

Bryan W Reed

Techniques are described herein that are capable of forming a depth map and/or projecting an image onto object(s) based on the depth map. A depth map is a three-dimensional representation of an environment. Forming the depth map may utilize a progressive resolution refinement technique. For example, locating information may be determined in accordance with the progressive resolution refinement technique in response to performing a scan of a current point over a field of view. The current point is a point, selected from a plurality of points (e.g., a grid of points) in the field of view, to which a detection beam of light is directed at a respective time as the scan is performed over the field of view. In accordance with this example, the locating information may be coordinated with the scan to form the depth map.

Portable panoramic laser mapping and/or projection system

Disclosed is a method of forming an interconnect in a substrate having a first surface and a second surface. The method includes forming an insulating structure abutting the first surface and defining a closed loop around a via in the substrate and forming an insulating region abutting the second surface such that the insulating region contacts the insulating structure and separates the via from a bulk region of the substrate. Forming the insulating structure includes etching the substrate beginning from the first surface to form a trench, filling the trench to form a seam portion, and converting a first portion of the substrate to a first solid portion to form the closed loop.

Electronic systems with through-substrate interconnects and MEMS device

This disclosure presents a non-contact, frequency modulated continuous wave (FMCW) coherent optical distance measuring system and method for determining a measured distance over a wide distance range and simultaneously with fine range resolution. The approach and apparatus presented within eliminates the need for expensive, high frequency post-detection electronics to perform the necessary signal processing to accurately determine distance.

Coherent optical distance measurement apparatus and method

Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.

Pressure sensor including deformable pressure vessel(s)

Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surface and a second surface, the interconnect includes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolation between the via and the bulk region.

A distance-measuring pixel apparatus includes a photonic integrated circuit disposed on a common substrate that further includes a photonic integrated circuit substrate having disposed thereon two 3 dB directional couplers, a GRIN lens, and a partially reflecting Faraday mirror having a first side that is optomechanically coupled to a second side of the GRIN lens; and a source laser, a first photodetector, and a second photodetector. A related distance measuring method includes, using the distance-measuring pixel apparatus, generating a local oscillator (LO) beam, generating an echo, combining the LO beam and the echo beam, splitting the combined LO beam and the echo beam, and producing a modulation of the photodetector assembly photocurrent at a frequency that encodes the distance of a remote object.

Photonic integrated distance measuring pixel and method of distance measurement

A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head. The single axis rotation unit is configured to extend at an angle from a known axis. The test head can be designed in the shape of a frustum with multiple sides. The calibration unit, system, and method can use combinations of gravitational excitation, Helmholtz coil excitation, and rotational rate excitation for calibrating the device under test. The calibration unit, system, and method can calibrate a 3 degree for freedom or higher MEMS devices.

Single motor dynamic calibration unit

Techniques are described herein that perform capacitance-based pressure sensing using pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. The void has a shape that is configured to change based on a change of pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel. The pressure vessel may be formed in the shape of an enclosed loop (e.g., along a path that is perpendicular to the cross section), resulting in a looped pressure vessel. For instance, an end of the pressure vessel may be connected to another end of the pressure vessel to form the enclosed loop.

Capacitance-based pressure sensor including pressure vessel(s)

A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.

Micro-electromechanical system devices

In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

Strengthened micro-electromechanical system devices and methods of making thereof

A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.

Growing community of inventors

Ithaca, NY, United States of America

Scott G Adams