Eastman-kodak Company

Scott E Phillips

Lee William Tutt

Timothy John Tredwell

Glenn T Pearce

John Andrew Lebens

Ronald Myron Wexler

David B Kay

Kelvin Nguyen

Yongtaek Hong

An inkjet printhead die includes a first endmost black nozzle of which is disposed proximate the first end of a substrate, and an opposite second endmost black nozzle of which is disposed a distance Dfrom the first endmost black nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance Dfrom the first endmost cyan nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance Dfrom the first endmost nozzle; wherein Dand Dsubstantially equal to each other, and wherein Dis greater than D

Nozzle array configuration for printhead die

A method of making micro-structure devices by coating a first layer of resist () on a substrate (). A pattern is created on the substrate by radiation induced thermal removal of the resist.

Laser ablation resist

A method for forming a resist pattern on a substrate () places a donor element () having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element () according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element () across the gap by ablative transfer and is deposited onto the substrate () forming the resist pattern.

Laser resist transfer for microfabrication of electronic devices

Growing community of inventors

Rochester, NY, United States of America

Scott E Phillips