Varian Semiconductor Equipment Associates, Inc.

Applied Materials, Inc.

Varian Semiconductor Associates, Inc.

Scott E Peitzsch

Roger Bradford Fish

David E Suuronen

Steven M Anella

Scott C Holden

Daniel A Hall

Robert J Mitchell

Michael Esposito

Richard V Chisholm

Robert A Poitras

A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.

System and method for controlling electrostatic clamping of multiple platens on a spinning disk

Provided herein are approaches for reducing particles in an ion implanter. In some embodiments, an electrostatic filter of the ion implanter may include a housing and a plurality of conductive beam optics within the housing, the plurality of conductive beam optics arranged around an ion beam-line. At least one conductive beam optic of the plurality of conductive beam optics may include a conductive core element, a resistive material disposed around the conductive core, and a conductive layer disposed around the resistive material.

Conductive beam optic containing internal heating element

A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.

System and method for minimizing backside workpiece damage

A system, instructions and a method of determining when an impending failure is likely to occur absent corrective action are disclosed. The system samples the output of a power supply which powers an electrostatic chuck, and determines when that output is outside acceptable limits. The output is sampled at a sufficiently high frequency so as to detect transient anomalies, which are not detectable at lower sampling rates. In some embodiments, the output is converted to a frequency spectrum. The empirical model is compared to known good reference models and, in some embodiments, failure reference models of known failure modes to determine whether an impending failure will occur, and which type of failure.

System and method for analyzing voltage breakdown in electrostatic chucks

A system and method for monitoring forces on a substrate lifting apparatus. The system includes a platen cartridge with a platen and a movable lifting portion. The movable lifting portion includes a plurality of lifting arms coupled to a plurality of lift pins. A plurality of force sensing elements are associated with respective ones of the plurality of lifting arms and the plurality of lift pins. A controller receives signals from the plurality of force sensing elements, correlates the signals to respective forces applied to said plurality of lift pins. The correlated forces may indicate to the controller that an error condition exists, such as a stuck wafer, a broken wafer, a mis-positioned wafer, or a mechanical malfunction.

Force sensing system for substrate lifting apparatus

An electrode pattern and layered assembly is disclosed. This assembly utilizes multiple-piece construction, including at least two electrically conductive layers and at least three electrically insulating layers. By incorporating a second electrically conductive layer, each electrode can be divided into two or more separate portions on the top layer, and joined together using the second conductive layer. Connections between the two conductive layers can be made using any suitable technique, including through-hole vias, conductive rods and the like. The use of a second electrically conductive layer also allows for a different gas distribution strategy. The use of multiple conductive layers allows the use of one or more concentric channels to be used through which the gas can be injected.

Method of platen fabrication to allow electrode pattern and gas cooling optimization

An ion implanter includes an electrostatic chuck. The electrostatic chuck is configured to repel charged particles from a surface of the electrostatic chuck to limit deposits of the charged particles on the surface when the electrostatic chuck is not supporting any workpiece. An electrostatic chuck including a dielectric layer and at least one electrode is also provided. The at least one electrode is configured to accept a DC voltage signal to produce a first charge to repel charged particles from the dielectric layer when the dielectric layer is not supporting any workpiece to thereby limit deposits of the charged particles on the dielectric layer.

Growing community of inventors

Tewksbury, MA, United States of America

Scott E Peitzsch