Micron Technology Incorporated

Round Rock Research, LLC

Rhino Metals, Inc.

Micro Technology, Inc.

Tri-walker, LLC

Scott E Moore

Scott G Meikle

Trung Tri Doan

Whonchee Lee

Dinesh Chopra

Stephen J Kramer

Gundu M Sabde

Jim J Hofmann

Magdel Crum

Michael A Walker

David W Carlson

Scott A Southwick

Donald Suggs

Daniel G Custer

Ernest E Marks

Brian A Vaartstra

Bryan C Carson

Ross H Burck

Shyam Surthi

Bryan J Ludwig

Randy L Tribble

Jayson Nelson

Jay D Barnett

Safe

Safes and related locking enclosures. In some embodiments, the locking enclosures may comprise a crank shaft that may be coupled with a handle. A crank plate may also be coupled with the crank shaft. A clutch mechanism may be coupled with the crank plate and configured to have an engaged configuration and a disengaged configuration. In the engaged configuration, the clutch mechanism may be configured to transfer torque from the crank shaft to the crank plate. In the disengaged configuration, the clutch mechanism may be configured to allow the crank shaft to rotate with respect to the crank plate such that no (or at least reduced) torque from the crank shaft is not transferred to the crank plate.

Safes and related locking enclosures

Toolbox

A method and apparatus for tracking items automatically is described. A passive RFID (Radio Frequency IDentification) tag is used with a material tracking system capable of real-time pinpoint location and identification of thousands of items in production and storage areas. Passive RFID tags are attached to the item to be tracked, remote sensing antennas are placed at each remote location to be monitored, interrogators with several antenna inputs are connected to the sensing antennas to multiplex the antenna signals, and a host computer communicates with the interrogators to determine item locations to an exacting measure.

RFID material tracking method and apparatus

A frame construction tool system, for wood frame buildings, or for metal, polymer, concrete, or composite frame buildings, and methods of using some or all of the tools of said tool system, are particularly well-adapted for roof and/or wall construction. Preferably, a laser light unit comprises a plurality of adjustments for directing the laser light in a variety of directions, preferably for vertical, horizontal, and pivotal adjustment. The laser light unit may be used with targets, cuttings guides, and/or prism units for splitting and/or redirecting the laser beam. In one embodiment, the laser light unit is used with reflective and/or translucent/transparent targets to accurately build a 'build-over roof' wherein the laser light unit maps out points and lines of an accurate connection between the roofs. In another embodiment, the laser light unit is used with one or more targets used at the top of a stud wall, to produce a straight line reference from one end/corner of a wall to another. In another embodiment, the laser light unit may be used with a cooperating cutting guide, to measure and properly cut a straight overhang for the roof or a deck and/or to measure and properly cut upending stud members in a pony wall. The preferred laser unit may be used with prism units to layout an entire building.

Building frame construction tools and methods using laser alignment

Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

Method for selectively removing conductive material from a microelectronic substrate

Methods and apparatuses for heat treatment of semiconductor wafers are disclosed herein. A method of heating a semiconductor wafer in accordance with one embodiment includes heating the wafer in a loading enclosure of a heat treatment system above an ambient temperature external to the loading enclosure. The method also includes moving the heated wafer from the loading enclosure into a processing enclosure of the heat treatment system. In particular embodiments, the method can further include heating a flow of purge gas above the ambient temperature and introducing the flow of heated purge gas into the loading enclosure while the wafer is in the loading enclosure. In still further embodiments, the method can include heating a flow of process gas to a processing temperature and introducing the heated flow of process gas into the processing enclosure while the wafer is in the processing enclosure.

Methods and apparatuses for heating semiconductor wafers

Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.

Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. The drag force parameter, for example, can be lateral displacement or lateral forces between a first component coupled to one of the substrate assembly or the polishing pad and a second component in either a carrier assembly holding the substrate assembly or a table supporting the polishing pad. The drag force parameter can be measured along a lateral axis to produce a waveform having minimum and maximum peaks relative to minimum and maximum peak drag forces between the substrate assembly and the polishing pad along the axis. The maximum peak drag forces or the difference of the minimum and maximum peak drag forces are processed to generate a force-time relationship. The status of a parameter, such as the onset of planarity or the endpoint of the process, is then estimated by analyzing the force-time relationship.

Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies

Growing community of inventors

Meridian, ID, United States of America

Scott E Moore