Motorola Corporation

Scott E Lindsey

Barbara Vasquez

William M Williams

Patrick F Thompson

Li Li

Jong-Kai Lin

Theodore Gerard Tessier

Yifan Guo

Chunsheng Zhang

A method of manufacturing components includes providing a substrate (,) having a first coefficient of thermal expansion (CTE), having a first surface (,), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (,) having a second CTE, having a second surface (,), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30&deg; C.

Method of manufacturing components and component thereof

A semiconductor wafer contact system includes a sealed bladder (32) containing incompressible material. The sealed bladder (32) presses against a flexible circuit layer (28) including an array of electrical contacts (30). The bladder (32) forces the array of electrical contacts (30) against a corresponding array of device electrical contacts (12) on die (11) of a semiconductor wafer (10). The bladder (32) adapts in shape to compensate for die level and wafer level irregularities in contact height and non-parallelism. Additionally, bladder (32) ensures a constant force between membrane contacts (30) and die contacts (12), across the entire wafer (10).

Semiconductor wafer contact system and method for contacting a

A semiconductor wafer contact system includes a base substrate (13) which has an array of raised supports (18). The array of raised supports (18) are distributed in a pattern corresponding to the pattern of electrical contacts (12) on the semiconductor wafer (10), to be contacted. In between the base substrate (13) and the wafer to be contacted (10) is a flexible circuit layer (14) including an array of electrical contacts (15) having the same pattern as the contacts (12) of the wafer and the raised supports (18). The raised supports (18) provide focused and localized force, pressing the membrane test contacts (15) against the wafer electrical contacts (12).

A process for etching a silicon substrate to form a feature such as a V-groove, utilizes a coating formed of an alkaline resistance polymer. A preferred polymer is poly(benzocyclobutene) resin. The coating is applied to the substrate and removed form a selected region whereupon the underlying silicon is etched with an alkaline solution. In one aspect, an optical fiber is inserted in the etched groove and coupled to an optical waveguide embedded within the coating.

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Mesa, AZ, United States of America

Scott E Lindsey