E.i. Dupont De Nemours and Company

Scott E Gordon

Kumaran M Nair

Mark Frederick McCombs

Deepukumar M Nair

Michael Arnett Smith

James M Parisi

Elizabeth D Hughes

Joao Carlos Malerbi

Ken E Souders

Kumaran Manikantan Nair

A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices

Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 &#x3bc;m. Also disclosed is a process for making the LTCC structure.

Low temperature co-fired ceramic structure for high frequency applications and process for making same

Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic)

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Cary, NC, United States of America

Scott E Gordon