Phoenix Contact Development and Manufacturing, Inc.

Scott David Lindstrom

Sooshin Choi

Michael Wayne Rothwell

Russell Brink

Dietmar Knecht

Patrick Kubovsky

Randal Earle Bradakis

Jessbir Singh Bajwa

Michael Ahlbrecht

Stephen Dale May

A fanless industrial computer enclosure dissipates heat generated by the hottest components on heat sinks dedicated to respective heat zones within the enclosure. Heat generated by the component that operates at the highest temperature in each heat zone is conducted to a heat sink on the exterior of the enclosure. Using a heat sink dedicated to each heat zone, heat generated by components such as an industrial computer, storage devices, power supply, or other electrical components, is dissipated on the outer surface of the enclosure to the surrounding ambient environment. Providing a low resistance heat conductive path from the hottest components to respective heat sinks to dissipate heat outside the enclosure from each heat zone creates an environment within the enclosure where disk drives do not exceed the specified upper operating temperature rating without regard to the operating temperature of other electrical components in the enclosure.

Enclosure with multiple heat dissipating surfaces

Industrial computer

Growing community of inventors

Mechanicsburg, PA, United States of America

Scott David Lindstrom