Seagate Technology Incorporated

Scott Daemon Matzke

Aaron Michael Collins

Paul Davidson

Christopher Unger

Jason Bryce Gadbois

Bradley Jay Ver Meer

Ravishankar Ajjanagadde Shivarama

Joseph Michael Stephan

Daniel Richard Buettner

Christopher R Libby

A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

Method of forming electrical connections using optical triggering for solder

An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.

Slider with trailing edge top bond pad interconnect

Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.

Assemblies and methods for slider electrical connection containing through circuit electrical connections

A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.

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Shakopee, MN, United States of America

Scott Daemon Matzke