International Business Machines Corporation

Xerox Corporation

Scott D Reynolds

Bahgat Ghaleb Sammakia

Joseph Funari

Voya Rista Markovich

Mark Vincent Pierson

Anthony P Ingraham

Morris Anschel

Michael D Lowell

Timothy Shawn Reny

Richard Gerald Murphy

Wayne R Storr

Charles Robert Lamb

Wolfgang Mayr

Terence C Godown

Tamar A Powers

Mary C Green

A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.

Method and apparatus for testing of integrated circuit chips

An attachment for removably thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which in turn is located on an integrated circuit card or board containing a body portion for contacting the chip, flange members extending from the body portion. Each of the flange members contains a pad-like member located at the end for contacting with the card or board. A compliant portion is present that extends away from the body portion for contacting the heat sink.

Attachment for contacting a heat sink with an integrated circuit chip

A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing. The heat sink housing has internal retention posts and internal posts receiving recesses that allow the two pieces to be snap fit together for easy assembly and disassembly. Also, a resilient latches the connector to the assembly. In one embodiment, the latch latches the connector to the assembly's printed circuit substrate, the edge of which substrate plugs into the connector. In other embodiments, the latch latches the connector to the assembly's heat sink housing. Also, in one embodiment, the latch is demountable and combined with an external clamp.

Pluggable electronic circuit package assembly with snap together heat

An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

Electronic package with improved heat sink

Heat and pressure fusing apparatus for fixing toner images. The fusing apparatus is characterized by the separation of the heat and pressure functions such that the heat and pressure are effected at different locations on a thin flexible belt forming the toner contacting surface. A pressure roll cooperates with a non-rotating mandrel to form a nip through which the belt and copy substrate pass simultaneously. The belt is heated such that by the time it passes through the nip its temperature together with the applied pressure is sufficient for fusing the toner images passing therethrough. The non-rotating mandrel is adapted to having its axis skewed relative to the axis of the pressure roll. A pair of edge sensors are provided for activating as mandrel skewing mechanism. Skewing of the mandrel by such mechanism effects proper belt tracking.

Low mass heat and pressure fuser

Heat and pressure fusing apparatus for fixing toner images. The fusing apparatus is characterized by the separation of the heat and pressure functions such that the heat and pressure are effected at different locations on a thin flexible belt forming the toner contacting surface. A pressure roll cooperates with a stationary mandrel to form a nip through which the belt and copy substrate pass simultaneously. The belt is heated such that by the time it passes through the nip its temperature together with the applied pressure is sufficient for fusing the toner images passing therethrough. A release agent management (RAM) system comprising low mass donor and metering rolls, one of which is in contact with the belt, applies silicon oil to the belt without unacceptably reducing the fusing capability of the belt.

Low mass heat and pressure fuser and release agent management system

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Endwell, NY, United States of America

Scott D Reynolds