Apple Inc.

Scott D Morrison

Paul Aurelio Martinez

Brad W Simeral

Lin Chen

Flynn P Carson

Albert Wang

Siddharth Nangia

Curtis C Mead

Karthik Shanmugam

Raymundo M Camenforte

Giancarlo F De La Cruz

Mattia Pascolini

Erik G De Jong

Yi Jiang

Trevor J Ness

Jayesh Nath

Siwen Yong

Steven P Cardinali

Carlo Di Nallo

Lijun Zhang

Jiangfeng Wu

Lan H Hoang

William C Lukens

Mario Martinis

Brandon R Garbus

Rex Tyler Ehman

Eduardo Jorge Da Costa Bras Lima

James G Horiuchi

Steven G Herbst

Jeffrey M Alves

Steven C Roach

Terry L Tikalsky

Zheyu Wang

Jorge L Rivera Espinoza

Mushtaq A Sarwar

Jim C Hwang

Kishore N Renjan

Manoj Vadeentavida

Kirill Kalinichev

Derek Fujio Iwamoto

Bilal Mohamed Ibrahim Kani

Yue Chen

Neeloy Roy

Kyusang Kim

Ali N Ergun

Wyeman Chen

Robert S Parnell

Jiaxiao Niu

Venkatesh Rajendran

Xiaofang Mu

Ming Yuan Tsai

Patrick J Crowley

Kiranjit Dhaliwal

Christopher D Guichet

Vu Thanh Vo

Tracey L Chavers

Woojin Jung

Kumar Nagarajan

Menglu Li

Rakshit Agrawal

Behzad Reyhani Masoleh

Kevin A Klenk

Zhiwei Gu

Annie Manuja

Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Molded silicon on passive package

Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.

Technologies for increased volumetric and functional efficiencies of optical packages

A wireless communication system may include an electronic device having a wireless communication module. The wireless communication module may include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio component mounted to a second surface. The wireless communication module may be incorporated into a system package that also includes other components. Encapsulation material may cover the wireless communication module and other components. A shielding material may cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material may be aligned with the antenna radiating element. If desired, the wireless communication system may include external equipment having a wireless communication module communicatively coupled to the wireless communication module to convey firmware testing, debugging, restore, and/or other data.

Wireless communication devices

Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

Wafer-level passive array packaging

A charging case for a pair of earbuds that comprises: a body having one or more cavities configured to receive the pair of earbuds; a lid attached to the body and operable between a closed position where the lid is aligned over the one or more cavities covering the pair earbuds and an open position that allows a user to remove the pair of earbuds from the body; one or more sensors that generates sensor data; a controller coupled to receive the sensor data from the sensor and operable to detect when the charging case is in freefall and/or suffers an impact event based, at least in part, on the sensor data and generate a trigger signal in response to detecting the impact event; and an earbud protection mechanism responsive to the trigger signal and operable to retain the pair of earbuds within the charging case.

Dynamic latching of hinged devices

Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

Stackable passive component

Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

Reduced electrical terminations in surface-mount technology components

Capacitor devices with electrodes that are geometrically arranged to reduce parasitic capacitances are described. The capacitors may be multilayer ceramic capacitor (MLCC) structures in which certain electrodes may have a clearance from a capacitor structure wall, such as top wall. In circuits and devices where that particular capacitor wall may be placed near a shielding structure, the clearance may reduce unintended parasitic capacitances between the shield structure and the electrodes. As a result, the shield structures may be placed closer to the electronic components, which may allow circuit boards and electronic devices with a lower profile.

Pseudo-shielded capacitor structures

An electronic device may have a display cover layer mounted to a metal housing. Electrical component layers such as a display layer, touch sensor layer, and near-field communications antenna layer may be mounted under the display cover layer. An antenna feed may have a positive feed terminal coupled to the electrical component layers and a ground feed terminal coupled to the metal housing. The electrical component layers may serve as an antenna resonating element for an antenna. The antenna may cover cellular telephone bands and may receive satellite navigation system signals. A system-in-package device may be mounted to the metal housing. A flexible printed circuit may extend between the electrical component layers and the system-in-package device. A mounting bracket for the system-in-package device may be provided with electrical isolation to enhance antenna performance in bands such as a satellite navigation system band.

Electronic device antennas with ground isolation

A receiver device in an inductive energy transfer system can include a touch sensing device. If the input surface of the touch sensing device is touched, a transmitter device can periodically stop transferring energy to allow the touch sensing device to sense touch samples while inductive energy transfer is inactive. Additionally or alternatively, a transmitter device can produce an averaged duty cycle by transferring energy to the receiver device for one or more periods at a first duty cycle step and for one or more periods at different second first duty cycle step. Additionally or alternatively, a transmitter device can reduce a current level received by a DC-to-AC converter if the current received by the DC-to-AC converter equals or exceeds a threshold. Additionally or alternatively, a transmitter device can ping a receiver device and transfer energy only after a response signal is received from the receiver device.

Operating an inductive energy transfer system

Growing community of inventors

Watertown, MA, United States of America

Scott D Morrison