World Properties, Inc.

Rogers Corporation

Scott D Kennedy

Michael E St Lawrence

Murali Sethumadhavan

Dirk M Baars

Sankar Paul

Allen F Horn, Iii

Carlos L Barton

Michael S White

Doris I Hand

E Clifford Roseen, Jr

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith

A circuit assembly comprises two or more circuit laminates, each comprising a conductive metal layer disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply layer comprising a thermoplastic or thermosetting material. The thermoplastic bond ply has a melting point between 250&#xb0; C. and 370&#xb0; C., a decomposition temperature greater than about 290&#xb0; C. and a dissipation factor of less than 0.01 at 10 GHz. The thermoset bond ply has a dissipation factor less than 0.01 at 10 GHz and a decomposition temperature greater than about 290&#xb0; C. after lamination. Methods of forming the above circuit assemblies are also disclosed.

Circuit materials, multilayer circuits, and methods of manufacture thereof

A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise the crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, of the liquid crystalline polymer layer by at least about 10&#xb0; C.

Method for making a multilayer circuit

Crosslinkable liquid crystalline polymer compositions for use as dielectric materials in circuit materials, circuits, and multi-layer circuits are disclosed. The crosslinkable liquid crystalline polymer compositions comprise crosslinkable liquid crystalline polymers that preferably comprise end groups selected from the group consisting of phenyl maleimide, nadimide, phenyl acetylene, or combinations of the foregoing. Additionally, the crosslinkable liquid crystalline polymer compositions may further comprise particulate fillers and/or fibrous webs. The crosslinkable liquid crystalline polymer compositions provided improved electrical and mechanical properties.

Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.

Circuits, multi-layer circuits, and methods of manufacture thereof

A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/&deg; C. and further wherein the multi-layer circuit is formed by lamination at a temperature of 0&deg; C. to about 10&deg; C. less than the melt temperature of the liquid crystalline polymer.

Liquid crystalline polymer bond plies and circuits formed therefrom

A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.

Growing community of inventors

Canterbury, CT, United States of America

Scott D Kennedy