Thermal Corporation

Advanced Cooling Technologies, Inc.

Thermacore, Inc.

Modine Manufacturing Company

Aavid Thermal Corp.

Scott D Garner

Jerome E Toth

John H Rosenfeld

Jon Zuo

Kenneth G Minnerly

Jens E Weyant

James E Lindemuth

Daniel T Reist

David Bruce Sarraf

Peter M Dussinger

George A Meyer, Iv

John Hartenstine

Jonathan P Wattelet

William G Anderson

G Yale Eastman

Richard W Longsderff

Zhijun Zuo

James E Schmidt

E Michael Ames

Douglas W Grove

Kevin H Richardson

Geoffrey P Thyrum

Matt D Flannery

A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.

Double sided heat exchanger cooling unit

Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

CTE-matched heat pipe

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

Assembly and process for heat transfer with three surfaces

A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.

A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with integrated brackets integrally attached to the main portions, the integrated brackets form first L-shaped brackets which engage walls of the chassis, surfaces of the card module or a combination thereof. The L-shaped brackets provide bearing surfaces which reduces binding and wear when the card retainer device secures the card module in the channel of a chassis and enhances the conductance of heat through the card retainer device. The wedge members provide heat transfer paths between the card module and the chassis. Mating surfaces of mating wedge member interfaces have compound angles that produces an applied force orthogonal to a flange of the conduction card that is greater than the force applied parallel to the flange of the conduction card.

Card retainer device

The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.

Heat transferring clamp

The invention is a heat exchanger transferring heat from a small heat source to a moving fluid. The inherent limitation of such a system is that most of the heat transfer to the fluid occurs only in the immediate vicinity of the heat input even though a large surface area heat transfer structure such as fins or small fluid passages is used to enhance the heat transfer within the heat exchanger. The invention adds a heat pipe inside the heat exchanger enclosure and in contact with the heat transfer structure. The heat pipe spreads the incoming heat over a larger part of the surface area of the heat transfer structure and improves the heat transfer to the cooling fluid by furnishing multiple heat transfer locations without adding extra thermal resistance between the heat source and the fluid flow.

Heat exchanger with internal heat pipe

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross-section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.

Method for forming a heat dissipation device

An air-to-air heat exchanger, is provided that comprises a folded fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs; an insert overlay having an opening including two sets of uniform fingers, wherein each finger has a portion protruding into and essentially filling each trough on one surface of the folded fin core; an inset region between each finger portion and the end edges of each trough; a sealant within each inset region sealably attaching the insert overlay to the folded fin core; and an air flow divider plate. Heat exchanger components are also provided.

Air-to-air heat exchanger

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

Thermal management system and method for electronics system

A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Sintered grooved wick with particle web

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.

Growing community of inventors

Lititz, PA, United States of America

Scott D Garner