Medtronic, Inc.

Litton Systems, Inc.

Scott B Sleeper

David A Ruben

Peter C Tortorici

Mark E Henschel

Lary R Larson

Chunho Kim

Niels F Jacksen

Patrick F Malone

Samuel F Haq

Christopher T Kinsey

Songhua Shi

Mark S Ricotta

Yongqian Wang

Jeffrey L Galvin

James E Volmering

Joan A O'Gara

Roy L Inman

Mark K Preis

Brian S Child

David Brian Hall

Robert P Wise

During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

Systems for encapsulating a hybrid assembly of electronic components and associated methods

A feed-through assembly is presented. The feed-through assembly includes a first end and a second end with a body therebetween. The first end comprises a substantially L-shaped end and a block. The substantially L-shaped end includes a first contact surface. The block includes a second contact surface.

Feed-through assembly

A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.

Laser bonding tool with improved bonding accuracy

An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Encapsulation circuitry on a substrate

Assembly including a circuit and an encapsulation frame, and method of making the same

An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body. Each of the first and second multilayer end caps includes conductive elements on one side thereof and further includes conductive traces electrically connected to the conductive elements thereof. Each of the conductive traces of the first and second multilayer end caps terminate at a surface mount contact region along at least one edge thereof. The first and second multilayer end caps are attached to the first and second ends of the device body such that, when the accelerometer device is mounted on a substrate, the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined thereby.

Accelerometer for implantable medical device

An infrared line-scanning detector includes a scanner having an optical system, infrared linear photo-conductive detector providing an analog image signal, cooler, and conversion electronics for converting the image signal from the detector to digital electrical and digitally-encoded optical formats, all on a moving scanning platform of the scanner. The digitally-encoded optical format of the image signal takes the form of an encoded light beam which is beamed off of the moving scanning platform to a receiver on the stationary portion of the scanner. From the scanner, the image signal is transmitted in the optical format over a fiber optic cable to a reformatting, processing, analysis, and display portion of the imager. This latter portion of the imager allows the image signal to be converted once again to digital electronic format for processing, pattern recognition, image enhancement, storage, delayed display and comparison, and display in near-real time if desired.

Two-color photo-conductive linear detector

Growing community of inventors

Phoenix, AZ, United States of America

Scott B Sleeper