Rohm and Haas Company

Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Dow Global Technolgoies LLC

Shipley Company LLC

Scott Alan Ibbitson

Robert H Gore

Zhenwen Fu

Richard Foster Merritt

Mark Robert Winkle

Hsing-Yeh Parker

Martha Alice Harbaugh Wolfersberger

Tirthankar Ghosh

Terence M Thomas

Hongyu Wang

Xiang-Qian Liu

Jill E Steeper

Janet Okada-Coakley

Michael K Gallagher

Arkady L Krasovskiy

Partha S Majumdar

Thomas John Procaccio

The present invention relates to a composition comprising an aqueous dispersion of a binder and a salt of the following fluoroalkyl phosphate: where n, p, q, R, and Rare defined herein. The composition of the present invention is useful as a block additive in paint formulations.

Alkoxylated fluoroalkylphosphate composition

A method for chemical mechanical polishing of a semiconductor wafer containing a nonferrous metal is provided, comprising: providing a chemical mechanical polishing composition comprising 1 to 25 wt % of an oxidizer; 0.01 to 15 wt % of an inhibitor for the nonferrous metal; 0.005 to 5 wt % of a copolymer of poly(ethylene glycol) methyl ether(meth)acrylate and 1-vinylimidazole; and water; wherein the chemical mechanical polishing composition has an acidic pH; providing a chemical mechanical polishing pad; providing a semiconductor wafer containing the nonferrous metal; creating dynamic contact between the chemical mechanical polishing pad and the semiconductor wafer; and, dispensing the polishing solution at or near the interface between the chemical mechanical polishing pad and the semiconductor wafer.

Chemical mechanical polishing composition and methods relating thereto

A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.

Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.

Photosensitive composition

An adjustable clamp holder having multiple securing mechanisms for each attachment structure of the clamp body is disclosed. The clamp has utility in fastening together support rods and supporting an apparatus or laboratory equipment. The clamp holder obviates the limited securing capabilities and safety concerns associated with previously known clamping devices.

Safety clamp holder

Acrylic polymer compositions with crystalline side chains are disclosed. Solution polymerization, aqueous suspension polymerization, and aqueous dispersion polymerization processes for the preparation of the acrylic polymer compositions with crystalline side chains are also disclosed. Methods of use for the acrylic polymer compositions with crystalline side chains, including dry powder coatings; wax replacements in floor polishes and wood coatings; nonwoven and textile coatings; adhesives; and hot melt adhesives are also disclosed.

Acrylic polymer compositions with crystalline side chains and processes for their preparation

Porous polyimide dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous polyimide dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous polyimide dielectric material.

Porous materials

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Trappe, PA, United States of America

Scott Alan Ibbitson