Motorola Corporation

Scot W Taylor

Earl K Davis

Rafael Landron

Kent W Hansen

Robert M Wentworth

Garland D Cotney

Parts tray

An improved lead-free glass or glass plus alumina ceramic sealing material composition for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:

Lower temperature glass and hermetic seal means and method

An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:

An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.

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Tempe, AZ, United States of America

Scot W Taylor