Micron Technology Incorporated

Scot M Graham

Stephen R Porter

Scott James Derner

Ethan Williford

Luan C Tran

Steven Howell

Kevin G Duesman

Venkatraghavan Bringivijayaraghavan

Abhay S Dixit

Techniques for reducing gate induced drain leakage (GIDL) in memory devices utilizing negative wordline architectures. More specifically, a method and apparatus are provided to determine whether any of the word lines in a section of a memory array are active. If any one of the plurality of word lines is active, each of the inactive word lines in the section are coupled to a negative voltage level. If none of the plurality of word lines is active, each of the plurality of word lines is coupled to ground to reduce GIDL.

Techniques for reducing leakage current in memory devices

A method and apparatus is provided for reducing the current in a memory device. Peripheral device control signals are translated to the wordline off voltage level, such as a negative wordline voltage. The translated signals prevent the peripheral devices from conducting current in the wordline off mode, even if a wordline-to-digitline short should occur. The control signals may include a column select signal for a column select device and an active pull-up signal for a sense amplifier, among others. Additionally, an equalization circuit having high and low resistance components is provided for the memory device. The equalization circuit limits current, even if a wordline-to-digitline short occurs.

Apparatus and method to reduce undesirable effects caused by a fault in a memory device

A memory device includes isolation devices located between-memory cells. A plurality of isolation lines connects the isolation devices to a positive voltage during normal operations but still keeps the isolation devices in the off state to provide isolation between the memory cells. A current control circuit is placed between the isolation lines and a power node for reducing a current flowing between the isolation lines and the power node in case a deflect occurs at any one of isolation devices.

Isolation device over field in a memory device

A memory device includes isolation devices located between memory cells. A plurality of isolation lines connects the isolation devices to a positive voltage during normal operations but still keeps the isolation devices in the off state to provide isolation between the memory cells. A current control circuit is placed between the isolation lines and a power node for reducing a current flowing between the isolation lines and the power node in case a deflect occurs at any one of isolation devices.

A balanced sense amplifier control for open digit line architecture memory devices. Firing of the sense amplifiers on each side of a section of a memory device is controlled by a two stage NAND gate logic circuit that utilizes a tree routing scheme. By gating the global signal with a section signal through the two stage NAND gate logic circuit, the sense amplifiers on each side of a section can be fired simultaneously.

Balanced sense amplifier control for open digit line architecture memory devices

A semiconductor memory architecture is provided where isolation between adjacent memory cell pairs is accomplished by using an isolation transistor incorporating a programmable gate voltage to minimize subthreshold leakage. A testkey is provided internal to the memory chip that can be enabled while the memory chip is in a test mode. The testkey is capable of testing the isolation transistors for excessive leakage. The testkey is coupled to a translator, responsible for converting control signals from the testkey to isolation gate voltages. The testkey is used to determine whether the isolation transistor is leaky. The translator may adjust the isolation gate voltage to turn the transistors off harder. The present invention may further include an antifuse to permanently change the isolation gate voltage to a suitable value when the semiconductor leaves the testing mode.

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Boise, ID, United States of America

Scot M Graham