University of Windsor

Other

Sazzadur Chowdhury

Horst Schmidt

Aref Bakhtazad

An integrated circuit includes stacked benzocyclobutene layers and a circuit geometry comprising conductive electric traces and interconnects on and/or extending through the BCB layers. A first said BCB layer formed and partially cured state. A top surface masked with photoresist, and after exposure, etched selectively form through vias at locations corresponding to conductive interconnects of the circuit geometry associated with said first BCB layer. A further mask coating is applied and after exposure, conductive metal is deposited to infill vias and form the electric traces of the circuit geometry. Subsequent BCB layers are then likewise formed, etched masked and coated in the same manner.

Layered benzocyclobutene interconnected circuit and method of manufacturing same

A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 kHz.

Ultrasonic sensor microarray and its method of manufacture

Ultrasonic sensor microarray and method of manufacturing same

A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The transducers include silicon device and backing layers joined by a fused benzocyclobutene (BCB) layer which defines the transducer air gap, and which are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a matrix and are activatable to emit and receive reflected beam signals at a frequency of between about 100 to 170 kHz.

A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 Hz.

A radar system () is described including a transmitting assembly (), a receiving assembly (), a control unit () and a signal processing unit (). The transmitting assembly () receives an input signal () and transmits an incident radar signal (). The transmitting assembly () includes a Rotman lens () having a lens cavity (), a plurality of beam ports (), a plurality of array ports () and a patch antenna assembly (). The lens cavity () has a lens gap (h) between 10 microns to 120 microns, and preferably 40 microns to 60 microns. The patch antenna assembly () includes a plurality of antenna arrays () operable to receive a plurality of time-delayed, in-phase signals from the Rotman lens () and to transmit the incident radar signal () towards a target (). The receiving assembly () receives a reflected radar signal () and produces an output signal. The signal processing unit () compares the input signal () to the output signal and implements an algorithm determining the range, velocity and position of the target ().

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Windsor, CA, United States of America

Sazzadur Chowdhury