Ballard Power Systems Corporation

Siemens Vdo Automotive Corporation

Continental Automotive Systems Us, Inc.

Continental Automotive Systems Corporation

Sayeed Ahmed

Fred Flett

Douglas K Maly

Ajay V Patwardhan

Kanghua Chen

Scott Parkhill

Gerardo Jimenez

Pablo Rodriguez

Lizhi Zhu

Richard Joseph Hampo

Vijay Garg

John M Van Dyke

David Seniawski

Jason M Cardinal

Abul Masrur

A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Tri-level inverter

A system and method for controlling power converters are disclosed. Briefly described, one embodiment is a method comprising communicating at least one first control signal to an alternating current/direct current (AC/DC) power converter from a multi-converter system controller, the AC/DC power converter and the multi-converter system controller residing in a power system electronics housing, and communicating at least one second control signal to a direct current/direct current (DC/DC) power converter from the multi-converter system controller, the DC/DC power converter residing in a power system electronics housing.

System and method of commonly controlling power converters

A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.

Power converter architecture employing at least one capacitor across a DC bus

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Architecture for power modules such as power inverters

A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

Integration of planar transformer and/or planar inductor with power switches in power converter

A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Leadframe-based module DC bus design to reduce module inductance

A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Power converter

A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Dual power module power system architecture

Methods and related systems providing removal of heat from electric motors via fluid baths.

Assembly and method for direct cooling of motor end-winding

A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area. The power module may employ a lead frame and terminals accessible from an exterior of a module housing, for making electrical couplings to externally located power sources and/or loads.

Growing community of inventors

Canton, MI, United States of America

Sayeed Ahmed