Cree Fayetteville, Inc.

Other

Wolfspeed, Inc.

Sayan Seal

Brice McPherson

Alexander B Lostetter

Brandon Passmore

Zachary Cole

Jennifer Stabach

Ty McNutt

H Alan Mantooth

Kuldeep Saxena

Devarajan Balaraman

Michael D Glover

A packaged electronic device comprises a power semiconductor die that comprises a first terminal and a second terminal, a lead frame comprising a lower side and an upper side that comprises a die pad region, a first lead and a second lead, wherein the first lead is integral with the lead frame and electrically connected to the first terminal of the power semiconductor die through the lead frame, a dielectric substrate, and a thermally conductive adhesion layer on an upper side of the dielectric substrate. The power semiconductor die is on the die pad region of the lead frame and the lead frame is on an upper side of the thermally conductive adhesion layer.

Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers

Power module

A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm. The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.

Silicon carbide power module

A flip-chip wire bondless power device and method for using a two sided contact bare die power device as a single-connection-level power device. The device uses a top pad solder ball array for connecting a top pad electrically connected to the top contact of the bare die power device and a bottom pad solder ball array for connecting a bottom pad that is electrically through an electrically conductive bottom pad connector that is electrically connected to the bottom contact of the bare die power device using an electrically conductive die-attach material, the top pad and bottom pad, and thereby the top pad solder ball array and the bottom pad solder ball array are planar for flip chip mounting. A trench can be formed between the top pad and bottom pad for isolation and insulation purposes. A method of assembling a flip-chip wire bondless power device is also provided.

Flip-chip wire bondless power device

Growing community of inventors

Fayetteville, AR, United States of America

Sayan Seal