Fuji Electric Co., Ltd.

Sayaka Yamamoto

Shuangching Chen

Shogo Ogawa

A semiconductor device is provided, comprising a plurality of circuit portions, and a first connection portion and a second connection portion that are formed of planar conductive materials and connected to any of the circuit portions, wherein the first connection portion and the second connection portion are arranged with respective main surfaces facing each other, the first connection portion and the second connection portion each comprising a circuit connection end connected to the circuit portions, a path restriction portion for restricting a current path in the main surface, directions of currents flowing through the current paths between the path restriction portions and the circuit connection ends are different in the first connection portion and the second connection portion. Directions of currents flowing through the current paths between the path restriction portions and the circuit connection ends are preferably different in the first connection portion and the second connection portion.

Semiconductor device

A semiconductor device is provided, which includes a semiconductor chip; a first current input/output portion that is electrically connected to the semiconductor chip; a second current input/output portion that is electrically connected to the semiconductor chip; three or more conducting portions provided with the semiconductor chip, between the first current input/output portion and the second current input/output portion; and a current path portion having a path through which current is conducted to each of the three or more conducting portions, wherein the current path portion includes a plurality of slits.

Current flow between a plurality of semiconductor chips

A semiconductor device with reduced variation in the resistance values of the current paths is provided. A semiconductor device including a first circuit block having a plurality of first circuit portions connected in parallel, a second circuit block having a plurality of second circuit portions connected in parallel, and an interblock connection portion electrically connecting the first circuit block and the second circuit block is provided. The interblock connection portion has a resistance adjusting portion that increases a resistance value in a current path from the first circuit block to a second circuit portion arranged closest to the first circuit block in the second circuit block.

In order to realize a thermistor on a base substrate without restricting the layout of a wiring layer, a thermistor mounting apparatus is provided, the thermistor mounting apparatus including a base substrate, and a thermistor component provided over the base substrate, in which the thermistor component has an insulating substrate, an electrode provided over the insulating substrate, and a thermistor provided over the insulating substrate and electrically connected to the electrode.

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Matsumoto, Japan

Sayaka Yamamoto