Sekisui Chemical Co., Ltd.

Sayaka Wakioka

Kohei Takeda

Takashi Shinjo

Yuta Oatari

Masami Shindo

Hiroaki Nakagawa

Yoshio Nishimura

Shujiro Sadanaga

Yuko Kawahara

Tatsushi Hayashi

Masahiro Itou

Susumu Baba

Carl Alvin Dilao

Atsushi Nakayama

Shuujirou Sadanaga

Shike Sou

Hidefumi Yasui

Yuta Yamanaka

Yangsoo Lee

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent

The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200&#xb0; C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.

Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board

There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.

Conductive material, connection structure and method for producing connection structure

The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy &#x394;E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260&#xb0; C., and a reaction rate of 40% or less at 4 seconds at 260&#xb0; C., as determined by differential scanning calorimetry and Ozawa method.

Adhesive for mounting flip chip for use in a method for producing a semiconductor device

Method for manufacturing semiconductor device and adhesive for mounting flip chip

The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 &#x3bc;m and a filler B having an average particle size of not less than 0.1 &#x3bc;m and less than 1 &#x3bc;m, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.

Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device

Growing community of inventors

Osaka, Japan

Sayaka Wakioka