Sony Semiconductor Solutions Corporation

Sony Corporation

Sayaka Aoki

Hiroki Naito

Daisuke Saito

Arata Kobayashi

Takahiro Koyama

Goshi Biwa

Akira Ohmae

Ippei Nishinaka

Tatsuo Ohashi

Yusuke Kataoka

Gen Sakoda

Toshio Fujino

Hideyuki Nishioka

Tsuyoshi Sahoda

A light-emitting device assembly includes a light-emitting device including a light-emitting layer, a first electrode, and a second electrode, and a first connecting portion and a second connecting portion provided on a base, in which the first connecting portion and the second connecting portion are separated from each other by a separation portion, the base is exposed from the separation portion, a wide portion is on a first connecting portion side of the separation portion, the first electrode includes a first portion and a second portion, the second portion of the first electrode is connected to the first connecting portion, the first portion of the first electrode extends from the second portion of the first electrode, and an orthographic projection image of the first portion of the first electrode with respect to the base and the wide portion of the separation portion overlap with each other at least in part.

Light-emitting device assembly, method of producing the same, and display apparatus

A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer

A light emitting device includes a light emitting part, a black layer, and a light diffusion partthat is formed on or above the black layer. The black layeris provided with an opening partthat allows light emitted from the light emitting part to pass through it. Then, light having passed through the opening partpasses through the light diffusion part

Light emitting device and display apparatus

A light-emitting element wafer includes a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Light-emitting element wafer, light emitting element, electronic apparatus

A light-emitting element includes a light-emitting layer, and an optical function film. The light-emitting layer is configured to include a first plane with a first electrode, a second plane with a second electrode, and a circumferential plane connecting the first and second planes, the second plane being opposing to the first plane, and the light-emitting layer being made of a semiconductor. The optical function film is configured to include a reflection layer being able to reflect light coming from the light-emitting layer, the reflection layer being provided with first and second regions, the first region covering the second plane and the circumferential plane, the second region protruding from the first region to an outside of the light-emitting layer to expose an end plane thereof.

Light-emitting element having an optical function film including a reflection layer

Growing community of inventors

Kanagawa, Japan

Sayaka Aoki